Evaluation of copper coating ratio in steel/copper clad wire drwaing

Ko, Dae-Cheol; Lee, S.K.; Kim, B.M.; Joo, Gea‐Jae

doi:10.1016/j.jmatprotec.2006.11.131

Cited by 37 publications

(11 citation statements)

References 4 publications

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“…Cu 2+ penetrates the pores in the Ni-P inner layer and reacts with metal atoms from the substrate. However, adhesion of the coating deposited by displacement reaction is slightly poor when the Cu layer is directly deposited on the substrate [22,23]. Thus, the Cu layer was designed for deposition on the Ni-P inner layer rather than on the substrate directly.…”

Section: Introductionmentioning

confidence: 99%

Corrosion Resistance Of Electroless Ni-P/Cu/Ni-P Multilayer Coatings

Zhao

Zou

Hao

et al. 2015

Archives of Metallurgy and Materials

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coatings were prepared by deposition of Cu layer between two Ni-P layers. The Cu layer was deposited by metal displacement reaction between Cu 2+ and Fe atoms. Corrosion behavior of single-layer Ni-P coatings, double-layer Ni-P/Cu coatings, and three-layer Ni-P/Cu/Ni-P coatings were investigated by electrochemical tests in 3.5% NaCl solution. The three-layer coatings exhibited more positive E corr and decreased I corr compared with conventional single-layer Ni-P coatings, which indicated an improved corrosion resistance. The polarization curves of the three-layer coatings were characterized by two passive regions. The improved corrosion resistance was not only attributed to the function of the blocked pores of Cu. The Cu interlayer also acted as a sacrificial layer instead of a barrier in the coatings, which altered the corrosion mechanism and further improved the corrosion resistance of the coatings.Keywords: electroless plating, multilayer coatings, porosity, electrochemical tests, crystalline Cu layerWielowarstwowe powłoki Ni-P/Cu/Ni-P wytworzono metodą osadzania miedzi pomiędzy dwoma warstwami Ni-P. Warstwę Cu otrzymano dzięki reakcji wypierania metalu przez metal (dla miedzi i żelaza). Aby określić właściwości korozyjne jednowarstwowej powłoki Ni-P, dwuwarstwowej Ni-P/Cu oraz trójwarstwowej Ni-P/Cu/Ni-P przeprowadzono pomiary elektrochemiczne w 3,5% roztworze NaCl. Powłoki trójwarstwowe w porównaniu do jednowarstwowych wykazały się większą wartością E corr , przy malejącej wartości I corr . Wskazuje to na poprawę odporności na korozję. Krzywe polaryzacji dla powłok trójwarstwowych charakteryzują się występowaniem dwóch obszarów pasywacji. Poprawa odporności na korozję jest skutkiem nie tylko tzw. zjawiska blokowania porów w miedzi. Powłoka z Cu działała także jako warstwa protektorowa, modyfikując mechanizm korozji i poprawiając odporność korozyjną powłok.

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Section: Introductionmentioning

confidence: 99%

Corrosion Resistance Of Electroless Ni-P/Cu/Ni-P Multilayer Coatings

Zhao

Zou

Hao

et al. 2015

Archives of Metallurgy and Materials

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“…As demonstrated in figure 7(b), with the section's diameter of 7.05 mm and R at = 51.28%, the knob of the weld zone was not detectable and the entire area of the copper clad had the approximate thickness of 0.309 mm. According to the observations, after reducing the cross-section up to 51.28%, the copper clad was uniform throughout the region [12,49,50]. In figure 7(b), the dark part in the interface was aluminum oxide and some intermetallic materials, as indicated in figure 7(c).…”

Section: Microstructurementioning

confidence: 83%

“…Particularly in the CCA wire, increasing the tensile strength to a critical level will initially cause a peripheral rupture of the copper clad [31]. However, in the NCWD process, with reducing the ductility of the copper clad after each step of drawing, the probability of the rupture of the copper clad increases [5,12,56]. Knowing the effect of the die angle on the hardness of the copper clad layer in multi-stage wire drawing helps to make a decision in designing the process of production in the CCA wire drawing process [54,57].…”

Section: Micro-hardnessmentioning

confidence: 99%

“…Metallic multilayer materials, also called multilayer composites [1,2], cladding materials [3], clad composites [4,5], clad plates [6,7], bimetal composites [8,9] , composite rods [10,11] and clad wires [12], have been widely used in many industrial fields such as kitchen utensils [6,[13][14][15], automobile industry [9,14,16,17], aerospace [6,18], shipbuilding [6], biomedical devices [19] and heat exchangers [9,14,16,17]. Various combinations of materials like Al/St [6,9,20], Al/Ti [7,18,21,22], Al/Mg [11], Al/Ag [23], Al/Cu/Al [4,5], Cu/Zn/Al [1], STS/ Al/Cu [13], Cu/Ti [8], Ti/Cu/Ti [24], Ni/Cu [16] and Cu/St [12,25] have been employed to exploit excellent mechanical, physical, and chemical properties of each material in a new unit material. Copper cl...…”

Section: Introductionmentioning

confidence: 99%

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An investigation on micro-hardness, micro-structure and ductility of clad layer in copper clad aluminum wire under multi stage–NCWD

Sichani

Rahnama

Raghebi

et al. 2020

Mater. Res. Express

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The copper clad aluminum (CCA) wire was fabricated by roll forming of copper foil around the aluminum wire rode. Non-continuous wire drawing (NCWD) was employed to study the effect of wire drawing parameters on ductility, micro-hardness and microstructure of the copper clad layer. The NCWD process continued without intermediate annealing until cracks were observed on the copper clad layer. The cracks appeared after a 78% reduction in the cross-section. The micro-tensile test was performed on specimens with transverse curvature to determine elongation. A modified correction factor was introduced to correct the effect of curvature size on elongation. The introduced correction factor proportional to the sample characteristics was between 0.7 and 1.4. Moreover, variations in the hardness and microstructure of the copper clad layer were investigated in the base metal and at the welding zone. Before beginning the wire drawing process for the annealed CCA wire with a diameter of 10.1mm and a Cu clad thickness of 0.48mm , the hardness, ductility, UTS and grain size of the clad layer were 87HV, 43%, 103MPa and 80 μm, respectively. At the end of NCWD for 10°a nd the 20% reduction ratio of the die, the diameter of CCA wire reached 4.7mm with a 0.22mm thickness of Cu clad. The hardness, ductility, UTS and grain size of the clad layer were 157HV, 2.9%, 325MPa and 8 μm, respectively.

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“…At present, types of composite wires are as follows: aluminum/copper clad composite, steel/ copper clad composite, steel/aluminum clad composite and carbon fiber-reinforced aluminum, etc. [3][4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Stress and Strain Analysis and Microstructure of Al/Cu Clad Composite Fabricated by Cold Extrusion

Luo

Xue

Liu

et al. 2016

Archives of Metallurgy and Materials

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StreSS and StraIn analySIS and MIcroStructure oF al/cu clad coMpoSIte FabrIcated by cold extruSIonA five-zone describing model for extrusion of aluminum/copper clad composite was established. Stress and strain were also analyzed by finite element method. The distribution rules of grain size were researched by critical shear strain theory, and zoning phenomenon of grain size was discovered. The grain size of deformed aluminum material becomes gradually finer from center to the interface. The grain size is much fine and the critical shear strain reaches the maximum value in the interface. The grain size of copper material reduces gradually from center to both the interface and exterior surface, which is caused by the higher value of critical shear strain in the interface and exterior surface. The analysis results were verified by microstructure observation and mechanical properties test, indicating that the distribution of grain size for cold extrusion forming can be interpreted by critical shear strain theory.

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Evaluation of copper coating ratio in steel/copper clad wire drwaing

Cited by 37 publications

References 4 publications

Corrosion Resistance Of Electroless Ni-P/Cu/Ni-P Multilayer Coatings

Corrosion Resistance Of Electroless Ni-P/Cu/Ni-P Multilayer Coatings

An investigation on micro-hardness, micro-structure and ductility of clad layer in copper clad aluminum wire under multi stage–NCWD

Stress and Strain Analysis and Microstructure of Al/Cu Clad Composite Fabricated by Cold Extrusion

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