Evaluation of New UV-Curable Adhesive Material for Stable Bonding between Optical Fibers and Waveguide Devices: Problems in Device Packaging

Elimination of Optical Fiber Breaks in Stainless Steel Packages for LiNbO3Optical Modulator Devices

“…1a and Ref. [27]. After the bonding between the fiber and LN chip, the fiber was thrust 35 m along the axis toward the LN chip and soldered at the end of the fiber feedthrough pipe, resulting in the fiber being bent slightly through the ∼25-mm gap between the LN chip and the soldered point.…”

“…The above assembled devices were placed in an oven at 60°C for 1 h for postcuring of the epoxy adhesive materials used in the package [27]. Then, a lid (stainless steel AlSl 304) was seam welded to the package in dry N 2 /He mixture (a dew point ഛ −40°C) [23].…”

Mechanical Reliability of LiNbO3Optical Modulators Hermetically Sealed in Stainless Steel Packages

“…A polarization maintaining fiber and a normal single mode fiber were butt-coupled to input and output ends of the LN chip waveguide, respectively, using a commercial ultraviolet (uv) curable epoxy (Daikin UV-1100), as shown in Fig. 2 [4]. A glass bead and an LN block were attached to the chip for reinforcement of the fiber bonding.…”

“…The present hermetic packaging was accomplished with an all metallic sealing technique using a stainless-steel (AISI 303) case which matched the thermal expansion of the LN material, instead of a conventional Kovar package. The fiber pigtail was butt-coupled to the LN waveguide using a new epoxy adhesive having a refractive index 1.46, "UV-1100" by Daikin Industries, Ltd. [4], to further reduce the optical return loss. The reliability evaluation of these unconventional materials, the AISI 303 package and new epoxy, is the main purpose of this article.…”

UV-curable Encapsulants for LED

“…The wet and tacky surface in acrylic systems due to the oxygen inhibition can be overcome by using intensive UVC light to ensure a rapid surface cure in the range of 100-400 mW/cm 2 . (11) Cycloaliphatic epoxide based cationic UV curable coatings offer the advantage of fast cure, low shrinkage, no oxygen inhibition 12 , and good electrical properties. These characteristic make them ideal for microelectronic packaging materials 12 .…”