1993
DOI: 10.1063/1.354918
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Evaluation of ohmic contacts formed by B+ implantation and Ti-Au metallization on diamond

Abstract: Low-resistance ohmic contacts have been fabricated on a naturally occurring B-doped diamond crystal and on polycrystalline diamond films by B ion implantation and subsequent Ti/Au bilayer metallization. A high B concentration was obtained at the surface by ion implantation, a post-implant anneal, and a subsequent chemical removal of the graphite layer. A bilayer metallization of Ti followed by Au, annealed at 850 °C, yielded specific contact resistance (ρc) values of the order of 10−5 Ω cm2 for chemical vapor … Show more

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Cited by 54 publications
(22 citation statements)
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“…9,10 Compared with the reported value, the c value that we obtained was high. This might be due to the contribution of the sputter defects, which could not be removed during the low-temperature annealing.…”
Section: ðCmsupporting
confidence: 49%
“…9,10 Compared with the reported value, the c value that we obtained was high. This might be due to the contribution of the sputter defects, which could not be removed during the low-temperature annealing.…”
Section: ðCmsupporting
confidence: 49%
“…3. Doping of diamond during growth or using ion implantation [5,6,10,11,12,13,14]. For example, to prepare good injecting contacts, several metals were used by Kozlov et aI., for hole injection they used Ag, Au, Pt or C deposition, aluminium or boron implantation, for electron injection P, Li or C [15].…”
Section: Iidevice Fabrication Issuesmentioning
confidence: 99%
“…Venkatesan et al 9 demonstrated ion-implanted ohmic contacts fabricated on CVD diamond using a dose of 3.5 ϫ 10 16 cm −2 . These structures contained a 0.2 m thick graphitized surface layer which was removed by etching and a Ti/ Au evaporated layer added to produce a low resistance ohmic contact ͑with a specific contact resistance of 1 ϫ 10 −4 ⍀ cm −2 ͒.…”
mentioning
confidence: 99%