Ohmic contacts and interface properties of Au/Ti/p-diamond prepared by r.f. sputtering

Abstract

The Au/Ti/p-diamond contacts were prepared by r.f. sputtering and I-V measurements showed that the as-deposited contacts were ohmic. Upon annealing at 500°C for 10 min in a vacuum of 10 −4 Pa, the ohmic characteristics of the contacts were improved by 30%. The specific contact resistivity, which was calculated by the transmission line model (TLM), decreased from 2.9 × 10 −3 to 2.0 × 10 −3 Z·cm 2 as a result of post-deposition annealing. Analysis by XPS indicated the formation of titanium carbide at the Ti/diamond interface in the as-deposited and annealed states. This gave the contacts their good ohmic characteristics.

Influence of Oxygen Plasma Modification Carbon Fiber on Flexural Strength and Hydrothermal Properties of CF/PES Composite

“…But because the surface of carbon fiber is so smooth and inert that it cannot easily be infiltrated by resin [4][5]. However, the surface inert of carbon fiber is quite high, so it is difficult to cohere to PES-C resin [6][7][8]. It is inevitable that the moisture and temperature can corrode and damage the composite and the two usually work and influence the composite at the same time [9][10][11].…”

Interdiffusion Analysis of Au/Ti and Au/Pt/Ti Electrode Structures Grown on Diamond (001) Surface by Rutherford Backscattering Spectroscopy

“…On the other hand, Wang et al and Zhen et al reported that the bilayer structure of Au/Ti prepared by RF sputtering deposition at room temperature (RT) already showed an ohmic property by I-V measurement, and annealing at 500 C for 10 min slightly improved it. 13,14) Naseem et al pointed out that Ti detected at the contact surface, which readily forming its oxides, increased the contact resistance. 15) It is known that Pt is one of the favorable candidates for suppressing the segregation of Ti across the Au layer.…”