Evaluation of Shear Properties of Indium Solder Alloys for Cryogenic Applications

Deshpande, Madhuri; Chaudhari, Rajesh; Narayanan, P. Ramesh; Kale, Harishwar

doi:10.1007/s11665-021-05983-y

Cited by 11 publications

(4 citation statements)

References 14 publications

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“…Four different solder alloy compositions: In-3Ag, In-34Bi, In-51Bi and In-32Bi-20Sn (wt.%) were manufactured using pure materials (In = 99.49%; Ag = 99.71%; Bi = 99.90% and Sn = 99.93%) and cast using graphite crucibles in laboratory muffle furnace with intermediate stirring at 450°C for 30 min of dwell time. Solder alloy preparation was outlined in our previous work (Deshpande et al , 2021).…”

Section: Methodsmentioning

confidence: 99%

Study of mechanical properties of indium-based solder alloys for cryogenic applications

Deshpande

Chaudhari

Narayanan

et al. 2022

SSMT

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Purpose This study aims to develop indium-based solders for cryogenic applications. Design/methodology/approach This paper aims to investigate mechanical properties of indium-based solder formulations at room temperature (RT, 27 °C) as well as at cryogenic temperature (CT, −196 °C) and subsequently to find out their suitability for cryogenic applications. After developing these alloys, mechanical properties such as tensile and impact strength were measured as per American Society for Testing and Materials standards at RT and at CT. Charpy impact test results were used to find out ductile to brittle transition temperature (DBTT). These properties were also evaluated after thermal cycling (TC) to find out effect of thermal stress. Scanning electron microscope analysis was performed to understand fracture mechanism. Results indicate that amongst the solder alloys that have been studied in this work, In-34Bi solder alloy has the best all-round mechanical properties at RT, CT and after TC. Findings It can be concluded from the results of this work that In-34Bi solder alloy has best all-round mechanical properties at RT, CT and after TC and therefore is the most appropriate solder alloy amongst the alloys that have been studied in this work for cryogenic applications Originality/value DBTT of indium-based solder alloys has not been found out in the work done so far in this category. DBTT is necessary to decide safe working temperature range of the alloy. Also the effect of TC, which is one of the major reasons of failure, was not studied so far. These parameters are studied in this work.

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Section: Methodsmentioning

confidence: 99%

Study of mechanical properties of indium-based solder alloys for cryogenic applications

Deshpande

Chaudhari

Narayanan

et al. 2022

SSMT

Self Cite

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“…[162] However, the reliability of the Sn/Pb solders has not been achieved so far. Interesting solders proposed are the low melting temperature SnÀ Bi solders, [163] In-based solders, [164] and ternary and quaternary Sn-based alloys. [165] The ban on Pbcontaining solders seriously impacted the world economy and electronic industry, as they needed to adapt to the new rules.…”

Section: Solder Based On Fusible Metalsmentioning

confidence: 99%

A Short History of Fusible Metals and Alloys – Towards Room Temperature Liquid Metals

et al. 2022

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Liquid metals are a class of materials with a millennia-long history, albeit until 200 years ago, mostly centered on mercurybased applications. The knowledge of mercury's toxicity and the discovery of it's bioaccumulation and biomagnification in the late 20 th century resulted in phasing out mercury for copious application. Lead-based, bismuth-based, and sodiumbased technology has partially replaced mercury, but due to toxicity or reactivity issues, replacements for lead and sodium are sought. The discovery of indium and, especially, gallium has allowed for the third generation of alloys with a melting point close to room temperature. This review gives a comprehensive overview of the technological developments of fusible and liquid metals, i. e., metals and alloys with melting points below ca. 250 °C, from the early days to current research and industrial application. Special emphasis is focused on important steppingstones and recent developments of gallium-based alloys as well as how they could be used for future applications.

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“…Solders from the In-Sn alloy system can offer potential advantages as joining materials for these applications as they have relatively low melting points and can help relieve mechanical stresses inside the electronic package due to their high ductility [ 9 , 10 , 11 ]. Moreover, for specific aerospace and low-temperature applications Indium-based solder alloys are considered to have better reliability under extended thermal cycles as they have been proven to retain good ductility even under cryogenic conditions [ 12 , 13 ].…”

Section: Introductionmentioning

confidence: 99%

Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints

et al. 2022

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This research evaluates the mechanical properties of a variety of binary In-Sn alloys as potential candidates for low temperature electronic joints. The tensile and hardness tests of as-cast In-5Sn, In-12.5Sn, In-25Sn, In-30Sn, In-35Sn, In-40Sn, In-50Sn, In-60Sn, In-80Sn (wt.%) were assessed at room temperature and compared to those of pure In and Sn. The ultimate tensile strength (UTS) increased from 4.2 MPa to 37.8 MPa with increasing tin content in the alloys under the testing condition of 18 mm/min and the results showed little difference under a lower strain rate (1.8 mm/min). Most compositions showed good ductility in tensile testing with an average of 40% elongation. A melting point range of 119.3 °C to 194.9 °C for tested alloys was measured using differential scanning calorimetry (DSC). The microstructure investigated by scanning electron microscopy (SEM) was discussed with respect to the mechanical properties and it has been found that the presence of the Sn-rich γ-InSn4 phase in the microstructure has a significant impact on mechanical properties. The fundamental data from this study can be used for the development of new low temperature In-Sn alloys.

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Evaluation of Shear Properties of Indium Solder Alloys for Cryogenic Applications

Cited by 11 publications

References 14 publications

Study of mechanical properties of indium-based solder alloys for cryogenic applications

Study of mechanical properties of indium-based solder alloys for cryogenic applications

A Short History of Fusible Metals and Alloys – Towards Room Temperature Liquid Metals

Mechanical Properties and Microstructure of Binary In-Sn Alloys for Flexible Low Temperature Electronic Joints

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