Evaluation of sweep resistance of Q Auto-Loop and Square-Loop bonds for semiconductor packaging technology

Kung, Huang-Kuang

doi:10.1016/j.microrel.2006.07.001

Cited by 19 publications

(8 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…For mathematical simplicity, we employ an elliptical wire bond profile to simulate the wire bond in semiconductor packaging. The similarity of wire sweep behavior between them is demonstrated to be within error variance [8], [9].…”

Section: Sag Deflection Theory For Elliptical Wire Bond Profilementioning

confidence: 88%

“…In order to prevent this failure, the mechanical behavior of wire sweep and wire sag has to be fully investigated and understood. A comprehensive study of the empirical model of wire sweep has been proposed by us earlier [8], [9]. This paper will focus on the development of sag deflection of wire bond for semiconductor applications.…”

Section: B Special Sag Deflection Case For An L-shaped Framementioning

confidence: 99%

See 1 more Smart Citation

Empirical Equation of Wire Sag Model for Semiconductor Packaging With Numerical and Experimental Verification

Kung

Hsiung

Lee

2013

IEEE Trans. Compon., Packag. Manufact. Technol.

Self Cite

View full text Add to dashboard Cite

For the semiconductor packaging industry, the issue of wire sag has not been touched upon because only one single layer of wire bond is constructed along the perimeter of the chip system. Over-sag deflections may not cause any problems. However, driven by the demands for smaller and faster advanced microelectronic devices, modern 3-D and multichip modules have become the solution of choice in delivering higher integration and more multifunctional products to meet consumer needs. For 3-D and multichip packaging, excessive wire sag can lead to wires touching against the lower layer, causing a short-circuit and failure of chip functionality. Therefore, gaining knowledge of wire bond sag theory becomes extremely important for advanced packaging. We propose an empirical model to predict the sag stiffness of a wire bond. The sag stiffness of a wire bond is defined to represent its resistance to the sag drag force occurring during the encapsulation process by the molding flow. A higher sag stiffness of a wire bond gives the premise of less sag deflection, thereby avoiding short-circuiting and/or double wire crosstalk due to the closeness of the top-layer to the bottom-layer wire bonds. The theory of sag regarding semiconductor wire bonding has not been documented, to our knowledge, in the literature. Therefore, to deal with this issue, this paper will primarily focus on the theoretical and numerical analysis of sag deflection of a wire bond. A set of sag experiments is conducted to verify the validity of the sag model hypothesis outlined in the earlier paper. Subsequently, an empirical sag model could be put forward to predict the sag stiffness of a wire bond if the corresponding bond spans, bond heights, and material properties are known. The engineered design of a wire bond can be improved through the use of this sag equation. By making use of the proposed sag model, one can attain not only a first-order estimation of the sag deflection but also omit the tedious procedures of numerical analysis.

show abstract

Section: Sag Deflection Theory For Elliptical Wire Bond Profilementioning

confidence: 88%

Section: B Special Sag Deflection Case For An L-shaped Framementioning

confidence: 99%

Empirical Equation of Wire Sag Model for Semiconductor Packaging With Numerical and Experimental Verification

Kung

Hsiung

Lee

2013

IEEE Trans. Compon., Packag. Manufact. Technol.

Self Cite

View full text Add to dashboard Cite

show abstract

“…The predictions of Eq. (2) has been shown to be more accurate as compared with experimental results [11].…”

Section: S *P =[Ib(t) £1 + It(t) Gj]mentioning

confidence: 91%

The effects of die thickness and bond height on wire sweep in multi-chip module and 3-Dimennsional packages

Chen

Huang

Kung

2008

2008 International Conference on Electronic Materials and Packaging

View full text Add to dashboard Cite

“…Certain geometry factor f of the wire bond can be easily evaluated by any numerical method. A more detailed discussion about the geometry factor of the wire bond can be referred to author's publication [2].…”

Section: Theoretical Model For Wire Sweep Stiffnessmentioning

confidence: 99%

The effect of cross-section geometry of bonding wire on wire sweep for semiconductor packages

Kung

Huang

Hsu

2010

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference

Self Cite

View full text Add to dashboard Cite

Evaluation of sweep resistance of Q Auto-Loop and Square-Loop bonds for semiconductor packaging technology

Cited by 19 publications

References 5 publications

Empirical Equation of Wire Sag Model for Semiconductor Packaging With Numerical and Experimental Verification

Empirical Equation of Wire Sag Model for Semiconductor Packaging With Numerical and Experimental Verification

The effects of die thickness and bond height on wire sweep in multi-chip module and 3-Dimennsional packages

The effect of cross-section geometry of bonding wire on wire sweep for semiconductor packages

Contact Info

Product

Resources

About