Proceedings of the 2014 37th International Spring Seminar on Electronics Technology 2014
DOI: 10.1109/isse.2014.6887565
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Evaluation of the interfacial resistance between carbon nanotube and silicon by using molecular dynamics simulations

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“…Despite the ultra-high thermal conductance of Single-Walled carbon nanotube (SWCNT) [6], the presence of surrounding media or substrates in the devices significantly affects their thermal transport properties [7][8][9][10]. The existence of strong interfacial phonon scattering in CNT-TIM structures and high heat flow density up to 10 8 W/m 2 [11]with local hot spot phenomenon severely limit the practical applications of microelectronic devices, and the high interface thermal resistance largely limits the applications of CNT.…”
Section: Introductionmentioning
confidence: 99%
“…Despite the ultra-high thermal conductance of Single-Walled carbon nanotube (SWCNT) [6], the presence of surrounding media or substrates in the devices significantly affects their thermal transport properties [7][8][9][10]. The existence of strong interfacial phonon scattering in CNT-TIM structures and high heat flow density up to 10 8 W/m 2 [11]with local hot spot phenomenon severely limit the practical applications of microelectronic devices, and the high interface thermal resistance largely limits the applications of CNT.…”
Section: Introductionmentioning
confidence: 99%