Evaluation results of a new EUV reticle pod based on SEMI E152

Ota, Ken‐ichiro; Yonekawa, Masami; Taguchi, Takao; Suga, Osamu

doi:10.1117/12.846316

Cited by 4 publications

(6 citation statements)

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“…(8) as Figure 9 shows the normalized standard deviation r add = ffiffiffiffiffi ffi N u p against the expectation value of the counting error N err-add / N u with data from Fig. (13) and (14). The symbols denote experimental results, and the solid line denotes the calculation result from Eqs.…”

Section: Discussionmentioning

confidence: 99%

“…However, many issues need to be resolved before the practical use of EUVL. For example, the increase in particles or defects should be examined in developing particle-free mask handling techniques, [8][9][10][11][12][13][14][15] and defect-free mask fabrication. [8][9][10][11][12][13][14][15][16] To resolve these issues, it is necessary to inspect the particles or defects that can increase or decrease during a process.…”

Section: Introductionmentioning

confidence: 99%

“…6,7 Similarly, the decrease in particles should be examined in developing mask-cleaning techniques. 9,10,12,13 The substrate was inspected after performing iterations of several hundred cycles, yielding an average of 0.8 particles added per iteration. For these inspections, a high level of accuracy is necessary to determine whether a particle has been added or released.…”

Section: Introductionmentioning

confidence: 99%

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Analytical and experimental evaluation of a counting method for particles added during the mask handling process

Amemiya

2012

Journal of Vacuum Science &Amp; Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phen

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Articles you may be interested inExperimental measurements of telecentricity errors in high-numerical-aperture extreme ultraviolet mask imagesExtreme ultraviolet lithography has emerged as a highly promising next-generation lithography technique. However, some practical issues around mask technologies remain unresolved. Typically, the technique requires counting the particles released from or added to a mask blank (achieved using the knowledge of their position), a process referred to as an increase/decrease inspection. The counting process of this inspection has not been sufficiently studied because of the complexities of the counting error caused by counting losses and noise. However, the analysis of the counting process is essential to improve the counting accuracy. The author modeled the counting process by considering the difference between the actual occurrence of adhesion (or release) of the particles and the detection of their adhesion (or release) and verified the model experimentally. The author determined the necessary conditions for achieving the required accuracy by the multiple-inspection method, in which particles detected multiple times are identified as actual particles. The author found the counting errors in the increase/decrease inspection by the multiple-inspection method can be expressed as a function of the following: the numbers of unchanged, added, and released particles; the singlecapture rate; and the number of inspections. Moreover, we found that the multiple-inspection method with four inspections is more accurate (pseudoparticles N p < 10 À4 , counting error N err ¼ 0:065, standard deviation r ¼ 0.26) than the single-inspection approach (N p ¼ 10, N err ¼ 3:3, r ¼ 1.7). The author confirmed that the multiple-inspection method reliably determines whether particles were released or adhered using positional information.

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Analytical and experimental evaluation of a counting method for particles added during the mask handling process

Amemiya

2012

Journal of Vacuum Science &Amp; Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phen

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“…The dual pod concept was standardized as SEMI E152-0709 "Mechanical Specification of EUV Pods for 150mm EUV Reticles" in 2009. MIRAI-Selete has conducted many shipping tests, vacuum handling tests and vacuum outgassing tests on the new SEMI compliant "cnPod" and results were reported in the 2009 EUVL Symposium [5,9]. SEMATECH also reported experiment results of their SEMI compliant EUV dual pod regarding to the adders for vacuum transfer and shipping in the symposium [10].…”

Section: Particle Control Readinessmentioning

confidence: 99%

Nikon EUVL development progress update

et al. 2010

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Nikon has been developing the full field exposure tool called EUV1 for process development of 32nm hp node and beyond. The unique feature of EUV1 is the capability of variable illumination coherence and off-axis illumination. EUV1 was installed in Selete and used for EUV lithography process development. Nikon also has conducted continuous collaborative works with customers using EUV1. Since the last SPIE Symposium in 2009, many exposure results with EUV1 tools were obtained. They showed excellent resolution capability beyond 24nm L/S with off-axis illumination and stable overlay capability of 10nm (Mean + 3 sigma). Process development exposures of test chip patterns are ongoing. With regard to HVM tool development, imaging capability with high NA projection optics and throughput capability are reviewed.

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“…6) For example, techniques using pressure difference, 7) electrical force, 8) and temperature gradient [8][9][10] have been proposed. Among them, a dual pod has been studied by exposure tool makers [11][12][13][14] and device makers as a carrier for shipping and handling in the tool, 13,[15][16][17][18][19][20][21][22][23][24][25][26] thus edging the dual pod closer to practical use.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Particle Protection Capability of Extreme Ultraviolet Lithography Mask Carrier in Vacuum Transfer by Experiment and Calculation

Amemiya

Ota²,

Taguchi³

et al. 2011

Jpn. J. Appl. Phys.

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In extreme ultraviolet lithography (EUVL), particle-free mask handling is a critical issue. We have studied particle protection capability of a dual pod, which consists of an outer pod and an inner pod that holds the mask. Our experiment and calculation demonstrated that a dual pod prevents particle addition in a quality area of 142×142 mm2 at the center of the mask, because particles entering the inner pod stopped near the edges. Our experiments showed 8 particle adders (≥46-nm polystyrene latex particle equivalent) for 1850-cycle transfer tests, and the dual pod satisfied the pre-production tool specification. Our measurement repeatability was 0.0015(σ)/cycle with a binominal distribution; however, we found that the accuracy was insufficient for an estimated specification of a high-volume machine. We discussed the necessary handling cycles and a method to improve repeatability by inspecting the area outside the quality area.

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Evaluation results of a new EUV reticle pod based on SEMI E152

Cited by 4 publications

References 0 publications

Analytical and experimental evaluation of a counting method for particles added during the mask handling process

Analytical and experimental evaluation of a counting method for particles added during the mask handling process

Nikon EUVL development progress update

Evaluation of Particle Protection Capability of Extreme Ultraviolet Lithography Mask Carrier in Vacuum Transfer by Experiment and Calculation

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