Evolution of defects in copper deformed by high-pressure torsion

Čı́žek, Jakub; Janeček, Miloš; Srba, Ondřej; Kužel, R.; Barnovská, Zuzana; Procházka, I.; Dobatkin, S. V.

doi:10.1016/j.actamat.2010.12.028

Cited by 122 publications

(48 citation statements)

References 32 publications

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“…1, is similar to earlier reports for pure Cu processed by HPT for up to 5-25 turns [26,[32][33][34][35][36][37][38][39] and also to reports for several Cu alloys [32,33,40,41]. The results from Cu-Zn alloys [32,33] suggest that the rate of hardness evolution is dependent upon the stacking fault energy of the alloy and this is consistent also with other data suggesting a significant influence of stacking fault energy on the development of an ultrafine-grained structure both in HPT processing [42][43][44][45][46][47][48][49] and in processing by ECAP [50][51][52][53].…”

Section: Hardness and Microstructure Evolution In Hpt Processingsupporting

confidence: 91%

Microstructural evolution and mechanical properties of a Cu–Zr alloy processed by high-pressure torsion

Wongsa-Ngam

Kawasaki

Zhao

et al. 2011

Materials Science and Engineering: A

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Section: Hardness and Microstructure Evolution In Hpt Processingsupporting

confidence: 91%

Microstructural evolution and mechanical properties of a Cu–Zr alloy processed by high-pressure torsion

Wongsa-Ngam

Kawasaki

Zhao

et al. 2011

Materials Science and Engineering: A

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“…Numerous reports are now available showing conventional hardening without recovery in pure Cu [15,[40][41][42][43][44][45][46][47] although there are two investigations showing the occurrence of softening when post-HPT annealing is conducted at elevated temperatures [35,48]. These results suggest, therefore, that the lower stacking fault energy of Cu prevents the occurrence of softening with rapid recovery as observed in high-purity Al.…”

Section: Introductionmentioning

confidence: 73%

Microstructure and microhardness of OFHC copper processed by high-pressure torsion

Almazrouee

Al‐Fadhalah

Alhajeri

et al. 2015

Materials Science and Engineering: A

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An ultra-high purity oxygen free high conductivity (OFHC) Cu was investigated to determine the evolution of microstructure and microhardness during processing by highpressure torsion (HPT). Disks were processed at ambient temperature, the microstructures were observed at the center, mid-radius and near-edge positions and the Vickers microhardness was recorded along radial directions. At low strains, Σ3 twin boundaries are formed due to dynamic recrystallization before microstructural refinement and ultimately a stabilized ultrafine grain structure is formed in the near-edge position with an average grain size of ~280 nm after 10 turns. Measurements show the microhardness initially increases to ~150 Hv at an equivalent strain of ~2, then falls to about ~80 Hv during dynamic recrystallization up to a strain of ~8 and thereafter increases again to a saturated value of ~150 Hv at strains above ~22. The delay in microstructure and microhardness homogeneity by dynamic recrystallization is attributed to the high purity of Cu that enhances dislocation mobility and causes dynamic softening during the early stages of straining.

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“…It was reported that HPT-deformed Cu contains a high density of dislocations and also small vacancy clusters which arise from the agglomeration of deformation-induced vacancies [93].…”

Section: The Nature Of Self-annealing In Cu Following Long-term Rt Stmentioning

confidence: 99%

The significance of self-annealing at room temperature in high purity copper processed by high-pressure torsion

Huang

Sabbaghianrad

Almazrouee

et al. 2016

Materials Science and Engineering: A

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High purity copper was processed by high-pressure torsion (HPT) at room temperature and then stored at room temperature for periods of up to 6 weeks to investigate the effect of self-annealing. Hardness measurements were recorded both at 48 h after HPT processing and after various storage times. The results show the occurrence of recovery near the edges of the discs after processing through 1/2 and 1 turn and this leads to a significant drop in the measured hardness values which is accompanied by microstructural evidence for abnormal grain growth. Conversely, there was no recovery, and therefore no hardness drops, after processing through 5 and 10 turns. X-ray line profile analysis was used to determine the crystallite sizes and dislocation densities at 1 h after HPT and after storage for different times.The results show a good thermal stability in high purity Cu after processing through more than 1 turn of HPT but care must be exercised in recording hardness measurements when processing through only fractional or very small numbers of turns.

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Evolution of defects in copper deformed by high-pressure torsion

Cited by 122 publications

References 32 publications

Microstructural evolution and mechanical properties of a Cu–Zr alloy processed by high-pressure torsion

Microstructural evolution and mechanical properties of a Cu–Zr alloy processed by high-pressure torsion

Microstructure and microhardness of OFHC copper processed by high-pressure torsion

The significance of self-annealing at room temperature in high purity copper processed by high-pressure torsion

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