Evolution of the functional properties of titanium–silver thin films for biomedical applications: Influence of in-vacuum annealing

Study of the electrical behavior of nanostructured Ti–Ag thin films, prepared by Glancing Angle Deposition

“…This aspect is particularly relevant for the temperatures of 673 K and 773 K. At these temperatures, new diffraction peaks can be observed at 2θ$ 43.4°; 2θ$ 53.0°and 2θ$ 62.9°, corresponding to the formation of the Ti 2 Ag intermetallic phase, according to ICSD database (code 605935). Indeed and attending to previous works by the authors, such structural evolution was expectable given the Ag concentration in the films, 11 at%, as determined by RBS [1,2]. The influence of the temperature in the thermal stability of Ti-Ag intermetallic thin films was already evaluated [2], and a schematic model of the thermal structure evolution, suggested by the authors, is depicted in Fig.…”

“…The electrical resistivity of metallic thin films depends on a large number of parameters, closely linked with the chemical composition and the structural and morphological evolution [1,2,10,11,19]. Fig.…”

“…In previous studies developed by the authors [1][2][3], intermetallic-like thin films of titanium-silver (Ti-Ag) were produced and optimized in order to functionalize flexible polymer-based bioelectrodes for sensing devices. The growing interest of using this system is particularly evident in the biomedical field, and is an outcome of the symbiosis between the titanium biocompatibility and the silver antimicrobial properties [4][5][6][7].…”

“…The growing interest of using this system is particularly evident in the biomedical field, and is an outcome of the symbiosis between the titanium biocompatibility and the silver antimicrobial properties [4][5][6][7]. Additionally, this binary intermetallic-like compound offers excellent biocompatibility, good wear and corrosion resistance, which together with proper multifunctional properties, extends its potential use in biomedical applications [1,2]. The suitable electromechanical response is very important for the bioelectrodes lifetime and was previously discussed by the authors with promising results, showing that the electrical signal acquisition was not compromised during the mechanical deformations promoted on the device [3].…”

“…Additionally, recent works reported on the remarkable thermal stability of TiAg x thin films, due the formation of Ti-Ag intermetallic compounds. Indeed, when thermally treated, the TiAg x coatings exhibited enhanced electrical, mechanical and thermal responses [2]. In this work, the electrical response of TiAg x sculptured thin films was assessed and performed during an annealing treatment cycle, for temperatures up to 773 K. Conclusions are taken on the capabilities and advantages of GLAD for the preparation of TiAg x conductive thin films, aiming at their use as biomedical sensing devices.…”