2012
DOI: 10.1109/temc.2012.2189573
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Exact Analytical Solution for the Via-Plate Capacitance in Multiple-Layer Structures

Abstract: An exact analytical solution for the via-plate capacitance in multilayer printed-circuit board (PCB) structures is presented. The formulation is based on Laplace's equation for the static electric potential within the via-plate region, which is electrically small for a large frequency range. The potential distribution is determined by the separation of Laplace's equation in cylindrical coordinates for the three subdomains: via barrel and pad, antipad, and the plate region. It is shown that the unknown viaplate… Show more

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Cited by 15 publications
(5 citation statements)
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“…2 as a function of the relative pad radius r p /r 0 . As can be seen, the former result [6] shows the unphysical initial decrease of the capacitance, as reported in [8] and [12]. The suggested alternative solution (15) shows a far better agreement with the numerical reference data.…”
Section: Via-plate Capacitancesupporting
confidence: 52%
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“…2 as a function of the relative pad radius r p /r 0 . As can be seen, the former result [6] shows the unphysical initial decrease of the capacitance, as reported in [8] and [12]. The suggested alternative solution (15) shows a far better agreement with the numerical reference data.…”
Section: Via-plate Capacitancesupporting
confidence: 52%
“…As can be seen, this expression is quite different from the result obtained in [6]. To demonstrate the improved accuracy, the example structure from [6], [9], and [12] is analyzed. It consists of a two-layer board with plates shorted, in order to obtain a single total capacitance.…”
Section: Via-plate Capacitancementioning
confidence: 77%
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