Excimer laser doping for the fabrication of 4H-SiC power devices

Abstract

4H–Silicon carbide (4H-SiC), which is a wide-bandgap semiconductor, is a promising material for high-power, ecofriendly devices owing to its excellent material properties. For the fabrication of SiC power devices, low-resistance ohmic contact must be established at the metal–semiconductor interface, which requires high-concentration impurity doping. In this study, we successfully doped 4H-SiC with high-concentration nitrogen under excimer laser irradiation using SiNx films containing dopants on 4H-SiC. Results indicated that a contact resistance of 10−6 Ωcm2 was obtained. The effects of doping characteristics due to different laser parameters were also investigated.