2012
DOI: 10.1007/s00340-012-5106-6
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Excimer laser machining of microvias in glass substrates for the manufacture of high density interconnects

Abstract: Machining of microvias in 100-50 µm thick CMZ glass using an excimer laser (248 nm)

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Cited by 5 publications
(1 citation statement)
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“…Excimer lasers are widely used in many applications, such as chemical analysis of solid samples by laser ablation inductively coupled plasma mass spectrometry (LA-ICP-MS) [1][2][3], high-resolution photolithography, which is a critical technology used in the manufacturing of microelectronic devices [4,5], micromachining and processing of a wide range of materials [5][6][7][8][9][10], and many other applications [11][12][13][14]. The fast growth in excimer laser applications over the last two decades is largely related to the availability of relatively low cost, reliable, and powerful commercial laser systems, together with the need for better understanding of laser-matter interaction [15,16].…”
Section: Introductionmentioning
confidence: 99%
“…Excimer lasers are widely used in many applications, such as chemical analysis of solid samples by laser ablation inductively coupled plasma mass spectrometry (LA-ICP-MS) [1][2][3], high-resolution photolithography, which is a critical technology used in the manufacturing of microelectronic devices [4,5], micromachining and processing of a wide range of materials [5][6][7][8][9][10], and many other applications [11][12][13][14]. The fast growth in excimer laser applications over the last two decades is largely related to the availability of relatively low cost, reliable, and powerful commercial laser systems, together with the need for better understanding of laser-matter interaction [15,16].…”
Section: Introductionmentioning
confidence: 99%