͑͒The chemical interface structure between phosphorus-doped hydrogenated amorphous silicon and aluminum-doped zinc oxide thin films is investigated with soft x-ray emission spectroscopy ͑XES͒ before and after solid-phase crystallization ͑SPC͒ at 600°C. In addition to the expected SPC-induced phase transition from amorphous to polycrystalline silicon, our XES data indicates a pronounced chemical interaction at the buried Si/ZnO interface. In particular, we find an SPC-enhanced formation of Si-O bonds and the accumulation of Zn in close proximity to the interface. For an assumed closed and homogeneous SiO 2 interlayer, an effective thickness of ͑5 Ϯ 2͒ nm after SPC could be estimated. ͓͔ Polycrystalline silicon ͑poly-Si͒ is a promising absorber material candidate for low-cost, high efficiency thin film solar cells. An attractive approach to obtain poly-Si at relatively low process temperatures is solid-phase crystallization ͑SPC͒ of hydrogenated amorphous silicon ͑a-Si:H͒. 1 Solar cell mini modules ͑94 cm 2 ͒ based on poly-Si prepared by the SPC process have already demonstrated efficiencies of up to 10.4% by utilizing a complex point contact design. 2 If this contact structure could be replaced by a transparent conducting oxide ͑TCO͒, the manufacturing process would be greatly simplified and an easy series interconnection scheme using laser scribing would become possible; both would aid large-scale mass production needed for commercialization. In addition, by texturing the TCO, one could easily improve light trapping. For these reasons, an Al/ a-Si: H͑p + ͒ / poly-Si͑p͒ / poly-Si͑n + ͒ / ZnO: Al/ glass device structure was recently suggested. 3 This design, however, involves a high-temperature annealing step ͑SPC at 600°C͒, which leads to significantly higher electron mobilities in the capped ZnO:Al layer 4 but could also induce chemical interaction/diffusion processes at/across the Si/ZnO interface. Hence, this letter presents a soft x-ray emission spectroscopy ͑XES͒ investigation of the buried Si/ZnO interface before and after SPC.For our experiments we used Borofloat ® borosilicate glass covered with an approximately 80 nm thick Si 3 N 4 layer ͑as diffusion barrier͒ as the substrate. As TCO a 900 nm ZnO:Al layer rf-sputtered onto the substrate was used ͓sample ͑i͔͒. Subsequently, 50 nm thin films of phosphorusdoped a-Si: H͑n + ͒ were deposited by plasma-enhanced chemical vapor deposition ͑PECVD͒ at approx. 200°C ͓sample ͑ii͔͒. For more details about sample preparation see Ref.2. After a-Si: H͑n + ͒ deposition, some samples underwent SPC at 600°C for 24 or 72 h in a tube furnace under N 2 -flow ͓samples ͑iii 24 ͒ and ͑iii 72 ͔͒. A schematic presentation of the investigated samples is shown in Fig. 1. To identify and eliminate spectral contributions of native silicon oxides at the Si thin film surfaces, XES measurements were performed before and after sample etching in hydrofluoric ͑HF͒ acid ͑30 s in 5% aqueous HF-solution͒. Reference materials ͑single crystalline Si as well as SiO 2 and ZnO powders͒ were charac...