Experimental and numerical study on the heat sink with radial fins and a concentric ring subject to natural convection

Li, Bin; Byon, Chan

doi:10.1016/j.applthermaleng.2015.06.083

Cited by 50 publications

(8 citation statements)

References 19 publications

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“…Effective cooling technology is a fundamental requirement for the reliable operation of electronics components such as highly integrated central processing units (CPUs), light-emitting diodes (LEDs), and energy-harvesting systems. [1,2] With the increase in power density due to the shrinking trend of feature size in electronics, the development of new thermal management techniques for avoiding electronic devices working under overheating conditions has drawn massive research attention worldwide. [3][4][5][6] Actually, without implementing an effective thermal path between the heat-generating device and the heatremoving component, problems such as reduced performance and short lifetime of electronic devices due to excess heat cannot be removed.…”

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Microstructure Growth Morphologies, Macrosegregation, and Microhardness in Bi–Sb Thermal Interface Alloys

et al. 2020

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Due to the rising demand for thermal management technologies within the electronics industry, there has been an increased emphasis on developing new thermal interface materials (TIMs) with enhanced performance. Despite Bi‐based alloys having exhibited promising potential as TIMs in microelectronics cooling applications, understanding the microstructure evolution of these alloys and the consequent effects on the resulting properties still remains an essential task to be accomplished. Herein, a directional solidification technique is used to investigate microstructural features and Vickers microhardness of Bi(5–20) wt% Sb alloys with a focus on the roles of alloy composition, solidification thermal parameters, and macrosegregation. The results show the formation of aligned Bi‐rich dendrites in a broad range of cooling rates from about 0.2 to 25 °C s−1. In contrast, as the alloy Sb content increases, two morphological transitions in the Bi‐rich matrix are shown to occur as follows: trigonal pattern → irregular shape → trigonal pattern. Then, primary and secondary dendritic arm spacings are related to growth and cooling rates through experimental equations. Finally, the occurrence of macrosegregation along the length of the Bi–20 wt% Sb alloy casting is shown to be a key factor associated with the variation of microhardness.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Microstructure Growth Morphologies, Macrosegregation, and Microhardness in Bi–Sb Thermal Interface Alloys

et al. 2020

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“…Three major elements of the cooling system are the heatsinks, the cooling method, and the thermal grease. The heatsink plays important role to dissipate heat from hot surface to the cool ambient [2]. The cooling method is applied to enhance the heat dissipation and this paper employs the forced air cooling [3].…”

Section: Introductionmentioning

confidence: 99%

“…For the heatsink and the cooling fan, not many studies were reported to focus on their degradation monitor. Mostly by measuring the temperature difference between the surface of the heat sink and the ambient temperature, the power loss of the device, the thermal resistance of the heat sink layer is worked out [2]. This method was similar with the above method of the grease monitor, which will face the same problem.…”

Section: Introductionmentioning

confidence: 99%

Monitoring of the Cooling System via Thermal Parameters

Zheng

Zhang

et al. 2019

IEEE Access

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The cooling system, including the thermal grease, heatsinks, plays an important role in the power converters for its reliable operation. While in the long-term operation situation, the cooling system will degrade with different kinds of failure mechanism of the components and finally result in the damage to the power converters. In this paper, the method was proposed to monitor the thermal network parameters of the cooling system using the cooling curves of junction temperature. By establishing the relationship between the RC parameters of Cauer network and time constants of cooling curves, the thermal parameters about cooling system can be obtained. Experimental tests are performed to verify the accuracy of proposed method. Results indicate the degradation state of the cooling system can be evaluated by monitoring the variation of thermal network parameters of the cooling system. INDEX TERMS Cauer thermal network model, cooling system, thermal network parameters.

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“…Their results show that the conventional correlations provide reliable predictions for the laminar flow. Li and Byon (2015) experimentally and numerically studied on the orientation effect for a radial heat sink with a circular base, concentric ring, and rectangular fins. They investigated the effects of orientation angle with respect to gravity, various geometric parameters (fin number, fin length, fin height, and height of the base), Elenbaas number, on the Nusselt number.…”

Section: Introductionmentioning

confidence: 99%

Influence of Aspect Ratio on Thermal Performance of Heat Sink using Ansys

2018

JAFM

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The integrated circuits face a huge issue to meet out the cooling demand due to the rapid development in technology. Several researchers have investigated the different possibility of cooling medium to improve the heat dissipation in an integrated circuits. Heat sink is a kind of thermal heat transfer device used to dissipate heat from an integrated circuit (IC) to surrounding due to low cost and reliability in heat dissipation. In this numerically work, the electronic chip with the heat sink is analyzed to study about the cooling rate, surface temperature of the chip, reliability and power dissipation of the chip with different heat transfer medium, fin height and fin thickness. The different heat transfer medium is air, water and engine oil. The ANSYS (v12) fluent software is used to study numerically about the electronic chip cooling. In this research work, the heat transfer rate of water is 9.5% greater than air and 1.4% than engine oil at the same Reynolds number is obtained. The power dissipation is increases up to 1.45% of the fin height 55mm and heat transfer rate is enhanced by increasing the fin thickness up to 2.10% in 6mm. However, the lifetime of the electronic chip with fin height 55mm is 2.06% hrs (day) greater than the fin with 35mm. It is observed that the electronic chip with water as a heat transfer medium with proper fin height and thickness is highly reliable to enhance the heat transfer than that of air and engine oil.

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Experimental and numerical study on the heat sink with radial fins and a concentric ring subject to natural convection

Cited by 50 publications

References 19 publications

Microstructure Growth Morphologies, Macrosegregation, and Microhardness in Bi–Sb Thermal Interface Alloys

Microstructure Growth Morphologies, Macrosegregation, and Microhardness in Bi–Sb Thermal Interface Alloys

Monitoring of the Cooling System via Thermal Parameters

Influence of Aspect Ratio on Thermal Performance of Heat Sink using Ansys

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