2014
DOI: 10.1063/1.4867048
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Experimental and simulation analysis of concave-down resistance curve during electromigration in solder joints

Abstract: Resistance curves play a crucial role in detecting damage of solder joints during electromigration. In general, resistance increases slowly in the beginning, and then rises abruptly in the very late stage; i.e., the resistance curve behaves concave-up. However, several recent studies have reported concave-down resistance curves in solder joints with no satisfactory explanation for the discrepancy. In this study, electromigration failure mode in Sn2.5Ag solder joints was experimentally investigated. The bump re… Show more

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Cited by 9 publications
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