Experimental determination of solid–liquid interfacial energy for solid Cd in Bi–Cd liquid solutions

Keşlıoğlu, K.; Erol, Mustafa; Maraşlı, Necmetti̇n; Gündüz, Mehmet

doi:10.1016/j.jallcom.2004.05.010

Cited by 33 publications

(12 citation statements)

References 24 publications

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“…[2, The common methods for measuring the solid-liquid interface energy include the nucleation-undercooling [2][3][4][9][10][11] and the grain-boundary methods. [12][13][14][15][16][17][18][19][20] The accuracy of the nucleation-undercooling method depends on the measured nucleation undercooling, that is, if homogenous nucleation occurs. However, no resolution has been reached as to how to determine the nucleation form.…”

Section: Introductionmentioning

confidence: 99%

“…For the grain-boundary method, the solid-liquid interface energy is determined in terms of the curvature and the temperature measured in the solid-liquid interface. The grain-boundary method can be used to directly measure the solid-liquid interface energy of eutectic alloys at the eutectic temperature [12][13][14][15][16][17][18] and peritectic alloys at the peritectic temperature. [19,20] However, it cannot be used to measure the solid-liquid interface energy at undercooled states.…”

Section: Introductionmentioning

confidence: 99%

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Crystal-Growth Transition and Homogenous Nucleation Undercooling of Bismuth

Jian

Chang

et al. 2011

Metall Mater Trans A

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The cross-sectional and surface morphologies of highly undercooled bismuth samples are investigated by optical microscopy and scanning electron microscopy. It is found that the grain morphology can be classified into three types. When the undercooling is less than 49 K (49°C), flaky grains with pronounced edges and faces are arranged parallel to each other, showing the feature of lateral growth. When the undercooling is over 95 K (95°C), refined equiaxial grains with several smooth bulges on the surface of each grain are randomly arranged, showing the feature of continuous growth. In the undercooling region from 49 K to 95 K (49°C to 95°C), the features of both lateral and continuous growth are observed. The microstructures within the sample grains obtained at different undercooling regions are dissimilar, but they all show features of anisotropic growth. Based on the critical growth-transition undercoolings, direct expressions that express the relationship between the solid-liquid interface energy and temperature are determined. Homogenous nucleation undercooling is also predicted according to the solid-liquid interface energy obtained from the critical growth-transition undercooling. The predicted results of homogenous nucleation undercooling for bismuth are in good agreement with the experimental results.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Crystal-Growth Transition and Homogenous Nucleation Undercooling of Bismuth

Jian

Chang

et al. 2011

Metall Mater Trans A

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“…[1,[7][8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26] The nucleation-undercooling method [1,7,8] and grain-boundary method [9][10][11][12][13][14][15] are the common methods to measure the solid-liquid interface energy of materials. By measuring the nucleation undercooling, the solid-liquid interface energy can be estimated from the homogenous nucleation equation.…”

Section: Introductionmentioning

confidence: 99%

“…By measuring the shape of the solid-liquid interface and the temperature, the solid-liquid interface energy can be calculated from the Gibbs-Thomson equation. This grain-boundary method has been wildly used to directly measure the solid-liquid interface energy of eutectic alloy at the eutectic temperature [9][10][11][12][13][14][15] and peritectic alloy at the peritectic temperature. [16,17] The limitation of the grainboundary method is that it can only be used to measure the solid-liquid interface energy of alloy at some specific composition at some restricted temperature.…”

Section: Introductionmentioning

confidence: 99%

Solid-Liquid Interface Energy between Silicon Crystal and Silicon-Aluminum Melt

Jian

Yang

Chang

et al. 2010

Metall Mater Trans A

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By examining the surface morphologies of undercooled Si-20 at. pct Al alloy during and after the solidification process, it is determined that the critical undercooling for silicon to grow from lateral mode to intermediary mode DT* and that from intermediary mode to continuous mode DT** are 131 and 239 K, respectively. A method that predicts the solid-liquid interface energy of binary lateral growth materials on the basis of DT* and DT** has been developed. Formulas between the physical parameters and the solid-liquid interface energy have been obtained. The interface energy between silicon crystal and Si-Al melt predicted from DT* is almost equal to that from DT**. The present results of the solid-liquid interface energy predicted according to DT* and DT** obtained in Si-20 at. pct Al alloy are in very good agreement with the reported results of the grain-boundary method and the critical undercooling method from DT* and DT** obtained in pure silicon.

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“…If the grain boundary groove shape, the temperature gradient in the solid (G S ) and the ratio of thermal conductivity of the equilibrated liquid phase to solid phase (R = K L /K S ) are known or measured the value of the Gibbs-Thomson coefficient (Γ ) is then obtained with the Gündüz and Hunt numerical method. Measurements of the solid-liquid interface energies were made in metallic binary eutectic based systems [19][20][21][22][23][24][25][26].…”

Section: Introductionmentioning

confidence: 99%