Experimental equilibrium phase diagram of the Ag–Bi–Sn system

Hassam, S.; Dichi, E.; Légendre, B.

doi:10.1016/s0925-8388(97)00617-8

Cited by 38 publications

(20 citation statements)

References 7 publications

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“…5 and Table 3. It is known that the bismuth additions can significantly depressed the melting temperature of Sn-Ag-based lead-free solder alloys [13,14]. Further advantage of adding bismuth into Sn-Ag system solder is the improvement of solder wetting/spreading behaviour [15,16].…”

Section: Discussionmentioning

confidence: 99%

Effect of Bismuth and Silver on the Corrosion Behavior of Lead-free Solders in 3.5 wt% NaCl Solution

Tamasi

Kosa

Szabó

et al. 2016

Period. Polytech. Elec. Eng. Comp. Sci.

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IntroductionOne of the key reliability issues of the electronics technology is carry about the solder joints testing. Usually, the different failures can lead back to the not adequate physical properties (e.g. wetting behaviour, mechanical strength, etc.) of the solder alloy and/or the not adequate applied technological processes (e.g. reflow temperature profile), which have to be improved. This challenge was updated in 2006, with the introduction of lead-free solder alloys governed by the RoHS directive of EU [1]. Due to the lead-free limitations, different solder types such as near-eutectic Tin-Silver, Tin-Copper, and Tin-Zinc alloys were produced as replacement for Tin-Lead solder materials. Furthermore, solders with more alloying elements, such as (Tin-Silver-Copper, Tin-Zinc-Silver, Tin-Zinc-Indium) and/or (Tin-Zinc-Silver-Aluminum, Tin-Silver-Bismuth-Copper, TinIndium-Silver-Antimony) were also investigated as replacements for Pb-free types [2]. While, the different qualifying studies of the Pb-free solder alloys are even active topics [3] and one of the issues is carry about humidity induced failures, like electrochemical corrosion [4,5]. Different results were also published related to novel Pb-free solder alloys in terms of reliability topics, such as solderability [6], intermetallic layer (IML) investigation [7], shear force tests [8], wetting investigations [9] or (solid state physics) migration tests [10]. On the other hand, the investigations of humidity induced failures (like corrosion) of Pb-free solder alloys are not deeply addressed in the scientific publications. In our former publication [11], various microalloyed Pb-free solders tested in terms of corrosion resistance using electroanalytical tests. In that study [11] different Pb-free solder alloys (four micro-alloyed and a Sn96.5Ag3Cu0.5 alloy as reference) were compared using potentiodynamic polarisation tests. During polarisation tests, the sample (working electrode) is scanned from a cathodic polarisation state, and after reaching the corrosion potential (Ecorr) it begins anodic polarisation. When the sample reaches the passivation potential, if possible a passivation film begins to form on the surface and the current density at this point is called the critical current density (Icrit). After this point the corrosion current density begins to drop to a much lower value. When a compact passivation film

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Section: Discussionmentioning

confidence: 99%

Effect of Bismuth and Silver on the Corrosion Behavior of Lead-free Solders in 3.5 wt% NaCl Solution

Tamasi

Kosa

Szabó

et al. 2016

Period. Polytech. Elec. Eng. Comp. Sci.

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“…Sn-Bi-Ag ternary phase diagrams have been calculated on the basis of constituent binaries by Kattner et al 30 and used for solidification studies, and then partially checked by microstructural examinations. Calorimetric studies of enthalpies of formation of liquid Ag-Bi and Ag-Bi-Sn alloys were performed by Hassam et al, 31 and recently, 32 the equilibrium phase diagram of this ternary system was studied by x-ray powder diffraction analysis, DSC, and DTA showing some differences in comparison with calculations by Kattner et al 30 Due to this, with the existing thermodynamic data from calorimetric studies 31 and the recent phase equilibria, 32 new evaluation and phase diagram calculations will be done to get the partial excess Gibbs energies of components needed for modeling of the surface tension of Ag-Bi-Sn ternary alloys.…”

Section: Discussionmentioning

confidence: 99%

Surface tension measurements of the Bi-Sn and Sn-Bi-Ag liquid alloys

Moser

Gąsior

Pstruś

2001

J. Electron. Mater.

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The maximum bubble pressure method has been used to measure the surface tension of pure Bi, surface tension and density of liquid binary Bi-Sn alloys (X Bi = 0.2, 0.4, 0.6, and 0.8 molar fractions) at the temperature range from about 500 K to 1150 K. Similarly, there were investigated ternary alloys adding to the eutectic (3.8\at.%Ag-Sn) 0.03, 0.06, 0.09, and 0.12 molar fractions of Bi. The linear dependencies of densities and surface tensions on temperature were observed and they were described by straight-line equation. It has been confirmed that the additions of Bi to liquid Sn and to the eutectic alloy (3.8at.%Ag-Sn) markedly reduce the surface tension. Experimental data of the surface tension of liquid Bi-Sn were compared with modeling based on Butler's method and a reasonable agreement was observed.

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“…The enthalpy values were measured by the direct reaction method, 16 and the experimental equilibrium phase diagram was investigated by Hassam. 37 Kattner and Boettinger calculated phase diagrams according to the extrapolation of three binary systems. 22 Limited information on the ternary alloy phase obtained from the CALP-HAD estimation was also reported by Ohtani et al 38 We started our investigation from the binary Ag-Bi system by adding Sn.…”

Section: Silver-bismuth-tin Systemmentioning

confidence: 99%

Thermodynamic Properties of Liquid Ag-Bi-Sn Alloys

Knott

Mikula

2006

Journal of Elec Materi

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As a promising lead-free solder, the thermodynamic properties of the liquid ternary Ag-Bi-Sn system were investigated. Using an appropriate galvanic cell, the partial free energies of Sn in liquid Ag-Bi-Sn alloys were determined as a function of concentration and temperature. Thermodynamic properties were obtained for 27 alloys. Their composition was situated on three cross sections with the constant ratios of Ag:Bi = 2:1, 1:1, and 1:2. The integral Gibbs free energy and the integral enthalpy for the ternary system at 900 K were calculated by Gibbs-Duhem integration.

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Experimental equilibrium phase diagram of the Ag–Bi–Sn system

Cited by 38 publications

References 7 publications

Effect of Bismuth and Silver on the Corrosion Behavior of Lead-free Solders in 3.5 wt% NaCl Solution

Effect of Bismuth and Silver on the Corrosion Behavior of Lead-free Solders in 3.5 wt% NaCl Solution

Surface tension measurements of the Bi-Sn and Sn-Bi-Ag liquid alloys

Thermodynamic Properties of Liquid Ag-Bi-Sn Alloys

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