Experimental evaluation of differential chip-to-antenna bondwire interconnects above 110 GHz

Valenta,; Spreng, Thomas; Ziegler,; Dancila, Dragos; Rydberg, Anders; Schumacher, Hermann

doi:10.1109/eumc.2014.6986608

Cited by 12 publications

(8 citation statements)

References 12 publications

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“…At 60 GHz, the parasitics of interconnects introduced by the packaging will cause impedance mismatch, degrading the overall performance. To solve these issues, flip-chip packaging is preferred because of its reduced parasitic effects [19]. As an alternative solution, the wire-bonding technique is still widely used because of its reliability and low cost [20].…”

Section: Bwcn-based Interconnectsmentioning

confidence: 99%

High‐gain low‐cost broadband 60 GHz differential integrated patch array antennas with wire‐bonding packaging and on‐board compensation network

Zhang

Zhao

et al. 2017

IET Microwaves, Antennas & Propagation

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Two high‐gain broadband 60GHz integrated planar patch array antennas, without and with air cavity, are designed and implemented on Rogers 5880 substrate. The differential antenna structure is used to improve the signal integrity at millimetre‐wave frequencies. The antennas are co‐designed with bonding wires of which the parasitic effect is compensated using a passive network. The proposed antennas have the advantages of symmetrical radiation pattern, wide bandwidth and low insertion loss. In the measurement, a differential transmission line based de‐embedding structure is developed on silicon, mimicking the real chip packaging environment and providing reliable terminations for antennas. The measured fractional bandwidths (|S11| < −10dB) are 13.8 and 26.2%, respectively, for the two structures without and with air cavity, including the effect of a waveguide‐to‐microstrip line transition and a branch‐line balun. Both antennas have measured gain of about 12 dBi. After de‐embedding the return loss, the measured insertion loss of the bond wire compensation network is only 0.07dB at 61GHz.

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Section: Bwcn-based Interconnectsmentioning

confidence: 99%

High‐gain low‐cost broadband 60 GHz differential integrated patch array antennas with wire‐bonding packaging and on‐board compensation network

Zhang

Zhao

et al. 2017

IET Microwaves, Antennas & Propagation

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“…The latter is the main focus of this paper, which presents results of an experimental study on different bondwire interconnects proposed for radar systems operating above 100 GHz. In this paper, we provide an in-depth analysis of the work introduced in [20]. In addition, recent results on wideband singleended interconnects are revealed here as well.…”

Section: Introductionmentioning

confidence: 99%

“…Although at present, on-chip antennas offer good radiation properties [20][21][22][23][24], the relatively large area they occupy on-chip may still be prohibitive for certain imaging and radar systems operating across F and D bands (half wavelength in the air at 100 GHz is approximately one and a half millimeter). Moreover, to achieve good radiation properties, the space surrounding the on-chip radiating elements should not contain any metal fillers, which is often incompatible with standard high-volume integration processes that require specified metal densities across all layers to achieve high yield.…”

Section: I D I F F E R E N T I a L C H I P -T O -A N T E N N A I mentioning

confidence: 99%

Design and experimental evaluation of compensated bondwire interconnects above 100 GHz

Valenta

Spreng

Yuan

et al. 2015

Int. J. Microw. Wireless Technol.

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Different types of bondwire interconnect for differential chip-to-antenna and single-ended chip-to-chip interfaces are investigated. Two differential compensation structures for various lengths of interconnects are designed and experimentally evaluated using dedicated transmit and receive radar modules operating across a 110-156 GHz band. Measurement results demonstrate that a fractional bandwidth of 7.5% and a minimum insertion loss of 0.2 dB can be achieved for differential interconnects as long as 0.8 mm. Design and measurement results of an extremely wideband low-loss single-ended chip-to-chip bondwire interconnect that features 1.5 dB bandwidth from DC to 170 GHz and insertion loss of less than 1 dB at 140 GHz are presented as well. The results show that the well-established wire-bonding techniques are still an attractive solution even beyond 100 GHz. Reproducibility and scalability of the proposed solutions are assessed as well.

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“…Wire-bonding is an interconnect technology that is widely used in (mm-wave) system packaging solutions. By designing matching network to compensate for the parasitic inductance of connecting wires, a good interconnect between chip and printed circuit board (PCB) can be obtained [14]- [23]. However, the performance is relatively narrow band and lossy.…”

Section: Introductionmentioning

confidence: 99%

A Flip-Chip Packaging Design With Waveguide Output on Single-Layer Alumina Board for E-Band Applications

Zhang

Zhao

Reynaert

2016

IEEE Trans. Microwave Theory Techn.

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This paper presents a millimeter-wave packaging design for E-band long-haul point-to-point communications. A broadband flip-chip interconnect with standard 75 µm pad pitch is developed on alumina substrate. To meet the application requirement, a microstrip line to WR-12 waveguide transition is proposed. The transition has no back-short cavity or modified waveguide involved. A back-to-back transition measurement is conducted to characterize the performance. Results show that the working bandwidth is from 69.5 to 87 GHz and the insertion loss at 77 GHz is less than 0.5 dB. A 40-nm CMOS power amplifier is packaged and measured with the proposed packaging design. The entire packaging loss is only 2.5 dB from pads to waveguide, including the loss of a 10 mm microstrip line. The simulated and measured results are in good agreement. The gain and peak output power are 13.4 dB and 17.6 dBm. The silicon temperature is measured as 44.4 • C after saturated output for 30 minutes. The performance is close to probe measurement after deembedding the packaging loss. Comparison between bondwire and flip-chip packaging is discussed and both are verified in millimeter-wave packaging design.

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Experimental evaluation of differential chip-to-antenna bondwire interconnects above 110 GHz

Cited by 12 publications

References 12 publications

High‐gain low‐cost broadband 60 GHz differential integrated patch array antennas with wire‐bonding packaging and on‐board compensation network

High‐gain low‐cost broadband 60 GHz differential integrated patch array antennas with wire‐bonding packaging and on‐board compensation network

Design and experimental evaluation of compensated bondwire interconnects above 100 GHz

A Flip-Chip Packaging Design With Waveguide Output on Single-Layer Alumina Board for E-Band Applications

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