2007
DOI: 10.1115/1.2753919
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Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors

Abstract: Microprocessor performance can be significantly improved by lowering the junction temperature, especially down to the deep subambient levels. This provides the strong motivation for the current study, which focuses on the design and thermohydraulic performance evaluation of high heat flux evaporators suitable for interfacing the microprocessor chip with a cascaded R134a∕R508b vapor compression refrigeration system at −80°C. Four compact evaporator designs are examined—a base line slit-flow structure with no mi… Show more

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Cited by 9 publications
(5 citation statements)
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“…Wadell (2005) yüksek lisans tezinde yüksek sıcaklık çevriminde R134a, düşük sıcaklık çevriminde R508B olacak şekilde tasarlanan iki kademeli bir soğutma sistemi üzerinde çalışmıştır. Sistemin R508B buharlaştırıcısına buharlaşma sıcaklığı -86°C ve -79°C; kütlesel debisi (0.833-1.167)x10-3 kg/s olacak şekilde akışkan göndermiş ve sonuçları incelemiştir.…”
unclassified
“…Wadell (2005) yüksek lisans tezinde yüksek sıcaklık çevriminde R134a, düşük sıcaklık çevriminde R508B olacak şekilde tasarlanan iki kademeli bir soğutma sistemi üzerinde çalışmıştır. Sistemin R508B buharlaştırıcısına buharlaşma sıcaklığı -86°C ve -79°C; kütlesel debisi (0.833-1.167)x10-3 kg/s olacak şekilde akışkan göndermiş ve sonuçları incelemiştir.…”
unclassified
“…Various refrigeration cooling schemes have been suggested to achieve this objective [2], [3]. Of those, vapor compression systems have attracted the most attention because of their relatively high cooling capacity at temperature of interest [4]- [7].…”
Section: A Application Of Refrigeration Coolingmentioning
confidence: 99%
“…One of the main objectives sought with this type of system is reaching lower evaporation temperatures than single-stage systems. In this sense, Coggins [66], based on previous work by Wadell [67], developed a two-stage cascade refrigeration system using R508B and R404A for cooling of high-performance microprocessors; however, the system was relatively large at 60,000 cm 3 . It was found that the cooling capacity of the system was 40 W, sufficient to maintain the chip at −61 • C.…”
Section: Modifications To the Basic Vapor Compression Cyclementioning
confidence: 99%