Experimental investigation of flow boiling characteristics in microchannels with the sinusoidal wavy sidewall

Xia, Guodong; Tang, Y.X.; Zong, Luxiang; Ma, Dandan; Jia, Yuting; Rong, Rao

doi:10.1016/j.icheatmasstransfer.2019.01.006

Cited by 64 publications

(7 citation statements)

References 36 publications

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“…The effect of the wavy channel on the thermal performance, pressure drop, friction factor and wall shear stress is reported. To further improve the heat transfer performances of the microchannel heat sink, the heat transfer enhancement in low Reynolds number flows with wavy walls are reported in these paper (Tiwari and Moharana, 2020;Gong et al, 2016;Aneesh et al, 2018;Rostami et al, 2015;Xia et al, 2019). Results show that these microchannels heat sinks provide better overall thermal performance.…”

Section: Variable Bend Amplitudementioning

confidence: 98%

Numerical analysis of the flow and heat transfer characteristics in serpentine microchannel with variable bend amplitude

Zhang

Liu

2020

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Purpose This study aims to propose the increase of heat dissipation requirements of modern electronic equipment and the fast development of micro-scale manufacturing technologies. The heat transfer mechanism is studied in-depth, especially for its pattern of secondary flow caused by the repeated inversion of centrifugal force. Effects of η on the frictional pressure drop and average Nusselt number are studied and the performance of such microchannel heat sink with various bend amplitudes is comprehensively evaluated. These results can provide important insight into the optimal design of this novel design configuration for microelectronics cooling. Design/methodology/approach A three-dimensional model based on the finite volume approach and SIMPLEC algorithm is performed to test an innovative serpentine microchannel, which behaves differently from conventional serpentine microchannel due to the significant effect of centrifugal force inversion. Findings The effect of centrifugal force significantly influences the flow and thermal fields which are responsible for the enhancement in heat transfer coefficient. The number, size and intensity of vortices increase with increasing Re, and the vortices are reformed at every change of the geometry in a periodic fashion. The serpentine microchannel studies more effectively at larger bend amplitude. Pressure fluctuations and temperature variation are greater with increasing bend amplitude. Practical implications Several techniques have been developed to augment single-phase convective heat transfer in channels. One technique is to use a serpentine channel that enhances the heat transfer due to flow mixing and periodic interruption of thermal boundary layers. This technique has been applied to micro-heat exchangers, thermal regenerators and mini/microreactors. Social implications The optimal design of this novel design configuration for microelectronics cooling can be attained. It will become an effective cooling technology for solving the increasing of heat dissipation requirements of modern electronic equipment. Originality/value The flow and heat transfer characteristics are first presented for the circular serpentine microchannel made up of alternate U-bends without interposed straight segments. The present study first examines the effect of such centrifugal force inversion on velocity contour, pressure distribution and temperature distribution. The patterns of secondary flow along the flow passage caused by the repeated inversion of centrifugal force are further studied in depth. The effect of bend amplitude on the flow and heat transfer is explored and the performance of such microchannel heat sink has been comprehensively evaluated.

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Section: Variable Bend Amplitudementioning

confidence: 98%

Numerical analysis of the flow and heat transfer characteristics in serpentine microchannel with variable bend amplitude

Zhang

Liu

2020

HFF

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“…Moreover, from the perspective of channel optimization design, Kwon and Kim (2015) designed the MOHPs with a dual-diameter channel and proposed that the design with double-diameters reduces the flow resistance of the working fluid and promotes the formation of bulk oscillation, thus improving the thermal performance of the MOHPs. Huang et al (2018), Xia et al (2019), andLi et al (2020) introduced curved structures into the micro-channels and proved that curved channels can effectively improve thermal performance of the micro-channels by promoting nucleation and destroying the heat transfer boundary layer. The curved micro-channel mentioned before with sinusoidal and triangular wavy sidewall gives new clues in terms of heat transfer enhancement methods for the MOHPs.…”

Section: Enhancement Of Mohps' Thermal Performancementioning

confidence: 99%

Viewpoints on the Recent Advances of Micro-Oscillation Heat Pipes

2022

Front. Energy Res.

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“…Width of microchannels (W) and number of microchannels (N) are selected as the design variables. The number of microchannels is in the range of 5-9 which is a typical value Thermal management of GaN HEMT devices for half region in microchannel-cooling (Xia et al, 2019;Ben Salah and Ben Hamida, 2019). Correspondingly, the width of microchannels (W) is given in the range of 10-24 um with an interval of 2 um.…”

Section: Multi-objective Optimizationmentioning

confidence: 99%

Numerical simulation and microchannels parameters optimization for thermal management of GaN HEMT devices

Wang

et al. 2021

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Purpose This study aims to satisfy the thermal management of gallium nitride (GaN) high-electron mobility transistor (HEMT) devices, microchannel-cooling is designed and optimized in this work. Design/methodology/approach A numerical simulation is performed to analyze the thermal and flow characteristics of microchannels in combination with computational fluid dynamics (CFD) and multi-objective evolutionary algorithm (MOEA) is used to optimize the microchannels parameters. The design variables include width and number of microchannels, and the optimization objectives are to minimize total thermal resistance and pressure drop under constant volumetric flow rate. Findings In optimization process, a decrease in pressure drop contributes to increase of thermal resistance leading to high junction temperature and vice versa. And the Pareto-optimal front, which is a trade-off curve between optimization objectives, is obtained by MOEA method. Finally, K-means clustering algorithm is carried out on Pareto-optimal front, and three representative points are proposed to verify the accuracy of the model. Originality/value Each design variable on the effect of two objectives and distribution of temperature is researched. The relationship between minimum thermal resistance and pressure drop is provided which can give some fundamental direction for microchannels design in GaN HEMT devices cooling.

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Experimental investigation of flow boiling characteristics in microchannels with the sinusoidal wavy sidewall

Cited by 64 publications

References 36 publications

Numerical analysis of the flow and heat transfer characteristics in serpentine microchannel with variable bend amplitude

Numerical analysis of the flow and heat transfer characteristics in serpentine microchannel with variable bend amplitude

Viewpoints on the Recent Advances of Micro-Oscillation Heat Pipes

Numerical simulation and microchannels parameters optimization for thermal management of GaN HEMT devices

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