Numerical analysis of the flow and heat transfer characteristics in serpentine microchannel with variable bend amplitude

Abstract

Purpose This study aims to propose the increase of heat dissipation requirements of modern electronic equipment and the fast development of micro-scale manufacturing technologies. The heat transfer mechanism is studied in-depth, especially for its pattern of secondary flow caused by the repeated inversion of centrifugal force. Effects of η on the frictional pressure drop and average Nusselt number are studied and the performance of such microchannel heat sink with various bend amplitudes is comprehensively evaluated. These results can provide important insight into the optimal design of this novel design configuration for microelectronics cooling. Design/methodology/approach A three-dimensional model based on the finite volume approach and SIMPLEC algorithm is performed to test an innovative serpentine microchannel, which behaves differently from conventional serpentine microchannel due to the significant effect of centrifugal force inversion. Findings The effect of centrifugal force significantly influences the flow and thermal fields which are responsible for the enhancement in heat transfer coefficient. The number, size and intensity of vortices increase with increasing Re, and the vortices are reformed at every change of the geometry in a periodic fashion. The serpentine microchannel studies more effectively at larger bend amplitude. Pressure fluctuations and temperature variation are greater with increasing bend amplitude. Practical implications Several techniques have been developed to augment single-phase convective heat transfer in channels. One technique is to use a serpentine channel that enhances the heat transfer due to flow mixing and periodic interruption of thermal boundary layers. This technique has been applied to micro-heat exchangers, thermal regenerators and mini/microreactors. Social implications The optimal design of this novel design configuration for microelectronics cooling can be attained. It will become an effective cooling technology for solving the increasing of heat dissipation requirements of modern electronic equipment. Originality/value The flow and heat transfer characteristics are first presented for the circular serpentine microchannel made up of alternate U-bends without interposed straight segments. The present study first examines the effect of such centrifugal force inversion on velocity contour, pressure distribution and temperature distribution. The patterns of secondary flow along the flow passage caused by the repeated inversion of centrifugal force are further studied in depth. The effect of bend amplitude on the flow and heat transfer is explored and the performance of such microchannel heat sink has been comprehensively evaluated.

Analysis of thermo-hydraulic and entropy generation characteristics for flow through ribbed-wavy channel

“…In this context, researchers have commonly used two methods for heat transfer enhancement; namely, active and passive ones. The passive method includes surface modifications such as corrugation at the channel wall, using baffles, blocks, twisted or helical tape (Jaferian et al , 2019; Li and Ake Sunden, 2018; Mereu et al , 2013; Tiwari and Moharana, 2019c; Zhang and Liu, 2020; Nandi and Chattopadhyay, 2013, 2014; Mehta et al , 2021), nanofluid and highly conductive porous media (Mehta and Pati, 2021a; Mehdi et al , 2014; Kameswaran et al , 2014; Bhowmick et al , 2021). While the active method needs external perturbation for flow with external sources such as electric or magnetic fields other than the pumping power.…”

Effect of fluid distribution along the channel length on the cooling performance of microchannel heat sink

“…In addition, the uneven temperature distribution in the electronic module leads to thermal stress and also damages the electronic module. These problems severely restrict the working performance of high-heat-flux electronic modules (Moore and Shi, 2014; Paramanandam et al , 2021; Xiang et al , 2022; Zhang and Liu, 2020).…”

Constructal design in the cooling and hydraulic performance of tube heat sinks

“…To ensure the reliability of the electronic systems, with a suitable heat dissipation from the electronic components, microtubes heat sinks area is a promising solution [6]. Serpentine tube heat sink design is described as a good option to address the problem of thermal management [7]. Wang et al [8] also studied cooling system designs composed by parallel tubes.…”