2019
DOI: 10.1016/j.vacuum.2019.01.032
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Experimental investigation of inductively coupled plasma etching on cemented carbides

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Cited by 13 publications
(4 citation statements)
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“…Therefore, the mold fabrication and process parameters are vital to the final NIL resolution and quality. The NIL mold is normally fabricated through photolithography [ 12 ], laser direct writer (LDW) [ 13 ], or electron beam lithography (EBL) [ 14 , 15 ], and subsequent dry etching and photoresist removal [ 16 , 17 ]. In general, dry etching may cause surface roughness, especially on the pattern sidewalls; increased inductively coupled plasma (ICP) power often increases the etching rate [ 17 ]; however, the resultant retarded heat dissipation might create a rough etched surface.…”
Section: Characteristics and Issues In Thermal And Uv Nanoimprint Lithographymentioning
confidence: 99%
See 1 more Smart Citation
“…Therefore, the mold fabrication and process parameters are vital to the final NIL resolution and quality. The NIL mold is normally fabricated through photolithography [ 12 ], laser direct writer (LDW) [ 13 ], or electron beam lithography (EBL) [ 14 , 15 ], and subsequent dry etching and photoresist removal [ 16 , 17 ]. In general, dry etching may cause surface roughness, especially on the pattern sidewalls; increased inductively coupled plasma (ICP) power often increases the etching rate [ 17 ]; however, the resultant retarded heat dissipation might create a rough etched surface.…”
Section: Characteristics and Issues In Thermal And Uv Nanoimprint Lithographymentioning
confidence: 99%
“…The NIL mold is normally fabricated through photolithography [ 12 ], laser direct writer (LDW) [ 13 ], or electron beam lithography (EBL) [ 14 , 15 ], and subsequent dry etching and photoresist removal [ 16 , 17 ]. In general, dry etching may cause surface roughness, especially on the pattern sidewalls; increased inductively coupled plasma (ICP) power often increases the etching rate [ 17 ]; however, the resultant retarded heat dissipation might create a rough etched surface. Additionally, cycles of etching and passivation are performed by switching SF 6 and C 4 F 8 gases in the Bosch process, where scallop structures are usually generated during the etch steps, causing significant roughness on the sidewall [ 18 , 19 , 20 , 21 ].…”
Section: Characteristics and Issues In Thermal And Uv Nanoimprint Lithographymentioning
confidence: 99%
“…After characterizing the mechanical properties of the cured resists, the UV-curable resists were UV imprinted on the pristine silicon mold with pillar arrays (figure 6). The subtle roughness (figure 6(d)) on the sidewalls may result from ICP etching [14]. The corresponding demolding force was measured from a clean separation between the mold and the cured resist using a uniaxial tensile system at room temperature.…”
Section: Demolding Force Measurementsmentioning
confidence: 99%
“…NIL technique utilizes a mold to mechanically press into a polymer resist [3,[6][7][8]. The mold is usually fabricated through photolithography [9], electron beam lithography (EBL) [10,11] or laser direct writer (LDW) [12] followed by dry etching such as inductively-coupled plasma (ICP) [13,14]. NIL is usually categorized into two types: thermal NIL and ultraviolet NIL (UV-NIL).…”
Section: Introductionmentioning
confidence: 99%