The deformation, crack nucleation, coalescence, and rupture process of pure tantalum (99.9 pct) were studied under room temperature quasistatic loading using several in situ and ex-situ techniques including optical metallography, scanning electron microscopy (SEM), electron backscatter diffraction (EBSD), and transmission-electron microscopy (TEM). The fracture surface of tantalum forms a ridge-and-valley morphology that is distinct from conventional notions of ductile dimple microvoid coalescence, and also distinct from spall damage formed during dynamic shock conditions. Failure proceeds by void nucleation at a dislocation cell wall or in subgrain interiors. Coalescence appears to involve a two-stage damage progression: first individual voids coalesce along the tensile axis forming diamond-shaped multivoid cavities; then cavities link-up by intercavity necking. Final rupture occurs when the intercavity necks thin tõ 100-nm films and fail by crystallographic cleavage. This final tearing process was observed using in situ TEM tensile deformation of a thin tantalum film. The detailed microstructural and morphological observations of the current study can be used to guide the development of improved models for tearing of ductile metals.