Experimental investigation on a novel composite heat pipe with phase change materials coated on the adiabatic section

Zhuang, Baoshan; Deng, Wenjun; Tang, Yong; Ding, Xinrui; Chen, Kaihang; Zhong, Guisheng; Yuan, Wei; Li, Zongtao

doi:10.1016/j.icheatmasstransfer.2018.12.006

Cited by 21 publications

(2 citation statements)

References 23 publications

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“…Under normal and heavy usage operations, the FHP-LMPCM configuration was able to maintain stable temperatures in the ranges of 30-59 C and 22.5-31 C, respectively. The combination of a flat heat pipe and PCM was explored by Weng et al [113] and Zhuang et al [114]. Under different periodic power inputs, it was seen that the composite heat pipe was able to lower the maximum to minimum temperature compared to the conventional heat pipe (without PCM).…”

Section: Combined Phase Change Material-heat Pipe/vapormentioning

confidence: 99%

A Review On Transient Thermal Management of Electronic Devices

Mathew

Krishnan

2021

Journal of Electronic Packaging

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Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varying workloads. These include microprocessors (particularly those used in portable devices), power electronic devices such as IGBTs, and high-power semiconductor laser diode arrays. Transient thermal management solutions become essential to ensure the performance and reliability of such devices. In this review, emerging transient thermal management requirements are identified, and cooling solutions reported in the literature for such applications are presented with a focus on time scales of thermal response. Transient cooling techniques employing actively controlled two-phase microchannel heat sinks, phase change materials (PCM), heat pipes/vapor chambers, combined PCM-heat pipes/vapor chambers, and flash boiling systems are examined in detail. They are compared in terms of their thermal response times to ascertain their suitability for the thermal management of pulsed workloads associated with microprocessor chips, IGBTs, and high-power laser diode arrays. Thermal design guidelines for the selection of appropriate package level thermal resistance and capacitance combinations are also recommended.

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Section: Combined Phase Change Material-heat Pipe/vapormentioning

confidence: 99%

A Review On Transient Thermal Management of Electronic Devices

Mathew

Krishnan

2021

Journal of Electronic Packaging

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“…Furthermore, it was shown that the use of a PCM with a lower melting point increases energy absorption efficiency. Zhuang et al [ 20 ] developed a hybrid HP with an integrated tank installed on its adiabatic section, containing RT55 paraffin wax. It was demonstrated that increasing the volume of PCM positively influences the performance of the HP.…”

Section: Introductionmentioning

confidence: 99%

Beeswax and Palmitic Acid Utilization with Heat Pipes for Electronics Cooling

Szymanski,

Paluch

2024

Adv Eng Mater

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This paper presents an experimental study of heat pipes supported by phase change materials (PCMs) coated at their adiabatic sections in application for electronics cooling. The PCMs investigated in this research were palmitic acid and beeswax, the latter being considered as a more cost‐effective alternative. The study focused on three powers: 20W, 25W, and 30W. The experimental results revealed that the incorporation of palmitic acid as a PCM led to a reduction in component’s maximum temperature by 13.3%, 12.6%, and 11.8% for the respective powers. Utilization of beeswax resulted in temperature reductions of 5%, 5.2%, and 8.4%. Notably, for higher heat flux conditions, the influence of beeswax on temperature control was comparable to that of palmitic acid. Furthermore, beeswax demonstrated a significantly higher capability to mitigate temperature decrease during cooldown, serving as a superior measure against overcooling. Moreover, during the thermal cycling scenario considered in this study, beeswax reduced the peak‐valley temperature by 25%, while palmitic acid achieved a reduction of 14.6%. These findings suggest that beeswax has the potential to serve as an alternative to traditional organic PCMs in electronics cooling applications that utilize heat pipes.This article is protected by copyright. All rights reserved.

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