Experimental investigation on cumulative propagation of thin film buckling under cyclic load

Wang, Shibin; Jia, Hanxiang; Li, Lin-an; Sun, Harold; Cui, Diqiang; Guo, Z.M.; Xue, Xiuli

doi:10.1007/s11431-011-4409-x

Cited by 11 publications

(3 citation statements)

References 15 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…However, delamination at the interface of thin film/substrate structure and buckles are generally observed because of the inevitably compressed residual stresses and thermal loading introduced into the films during manufacturing processes and working environment. As a result, if a large film is considered, some buckling patterns such as circular buckle (or blister) (Moon et al 2002), straight-sided wrinkle (Wang et al 2011c) and telephone-cord (or worm-like) wrinkle (He et al 2011), will be formed. In addition to the buckling modes under mechanical and thermal load, buckle-driven delamination of films under electrical loading is also reported.…”

Section: Introductionmentioning

confidence: 99%

Investigation of buckling transition from straight-sided to telephone-cord wrinkles in Al films

Jia¹,

Wang²,

Goudeau³

et al. 2013

J. Micromech. Microeng.

Self Cite

View full text Add to dashboard Cite

Aluminum films 150 nm thick have been deposited on polymethylmethacrylate (PMMA) substrates by a magnetron sputtering process. Parallel straight-sided wrinkles are induced by axial compression. The evolution from straight-sided to ‘telephone-cord’ wrinkles is experimentally investigated using optical microscopy. Finite element modeling of instability is introduced for analyzing the secondary bifurcation or buckling of straight-sided wrinkles. Imperfections based on a random combination of buckling eigenmodes are introduced in the finite element method (FEM) analysis to take into account secondary bifurcation. Because the perturbation of the imperfection is totally random and small, it is a more realistic approach for taking into account the roughness and flatness of the film. Moreover, the perturbation method can be applied more widely in some complex patterns of telephone-cord wrinkles. Good agreement is found between experimental observation and FEM calculations.

show abstract

Section: Introductionmentioning

confidence: 99%

Investigation of buckling transition from straight-sided to telephone-cord wrinkles in Al films

Jia¹,

Wang²,

Goudeau³

et al. 2013

J. Micromech. Microeng.

Self Cite

View full text Add to dashboard Cite

show abstract

“…In this research, in order to obtain the strain change law precisely and reduce the effects induced by mounted strain gauges, the back side of the vehicle was coated with special varnish to form numerous speckles, and they were used as virtual strain gauges, as shown in Figure 1(b). Dynamic strain data was measured by digital speckle measurement system based on digital image correlation method [29]. Figure 3 shows the process of strain data acquisition.…”

Section: Experimental Procedures Of Vibration Testsmentioning

confidence: 99%

Feature extraction for latent fault detection and failure modes classification of board-level package under vibration loadings

Tang

Jing

Huang

et al. 2015

Sci. China Technol. Sci.

View full text Add to dashboard Cite

A feature extraction for latent fault detection and failure modes classification method of board-level package subjected to vibration loadings is presented for prognostics and health management (PHM) of electronics using adaptive spectrum kurtosis and kernel probability distance clustering. First, strain response data of electronic components is filtered by empirical mode decomposition (EMD) method based on maximum spectrum kurtosis (SK), and fault symptom vector is developed by computing and reconstructing the envelope spectrum. Second, nonlinear fault symptom data is mapped and clustered in sparse Hilbert space using Gaussian radial basis kernel probabilistic distance clustering method. Finally, the current state of board level package is estimated by computing the membership probability of its envelope spectrum. The experimental results demonstrated that the method can detect and classify the latent failure mode of board level package effectively before it happened. board-level package, vibration loading, spectrum kurtosis, kernel probabilistic distance clusteringCitation: Tang W, Jing B, Huang Y F, et al. Feature extraction for latent fault detection and failure modes classification of board-level package under vibration loadings.

show abstract

“…Indeed, it is well known that buckling of thin film is linked to elastic instability that releases stresses in the film. Wrinkles generated in thin films have been studied by several authors [2][3][4][5][6][7]. Theoretical and numerical calculations based on Föpple-Von Karman equations have been performed for several typical modes (straight-sided wrinkle, telephone cord wrinkle, circular blister) [6,[8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis

Jia

Wang

Tamura

et al. 2018

QuBS

Self Cite

View full text Add to dashboard Cite

Compressive residual stresses generated during thin film deposition may lead to undesirable film damage, such as delamination, buckling, and flaking, ultimately leading to the failure of the device employing the film. Understanding the residual stress generation and role in these damage mechanisms is necessary to preserve thin film integrity and optimize its functional properties. Thin shell theory has been used for decades to predict buckling but the results have not yet been correlated with experimental data since the techniques used to measure stress in metallic films were not able to do so at the required micron scale until recently. Micro scanning X-ray diffraction now enables the direct mapping of the local stress of metallic films. In this paper, finite element method based on thin shell theory and synchrotron X-ray micro diffraction have been used to determine stress maps of thin film buckling patterns. Calculations of the stress distribution in the metallic films have been performed taking into account the buckling geometry determined from optical measurements. Stress distributions over gold blisters and tungsten wrinkles obtained with the two techniques are in fair agreement and allow for the accurate determination of the stress relaxation profile from the bottom to the top of the buckling, validating the thin shell theory model.

show abstract

Experimental investigation on cumulative propagation of thin film buckling under cyclic load

Cited by 11 publications

References 15 publications

Investigation of buckling transition from straight-sided to telephone-cord wrinkles in Al films

Investigation of buckling transition from straight-sided to telephone-cord wrinkles in Al films

Feature extraction for latent fault detection and failure modes classification of board-level package under vibration loadings

Stress Relaxation Related to Spontaneous Thin Film Buckling: Correlation between Finite Element Calculations and Micro Diffraction Analysis

Contact Info

Product

Resources

About