Experimental Investigation on Thermal Performance of Flat Plate Heat Pipe with Intersected Micro-Grooves

Wang, Chen; Liu, Zhong Liang; Zhang, Guang Meng

doi:10.4028/www.scientific.net/amr.772.480

Cited by 6 publications

(4 citation statements)

References 10 publications

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“…In the past two decades, many scholars have made and studied FHPs with different structures, sizes, and materials [16][17][18][19][20][21][22][23]. Table 1 shows summarization of the researchers study about FHPs and their performances of devices.…”

Section: Introductionmentioning

confidence: 99%

Performance test of an ultra-thin flat heat pipe with a 0.2 mm thick vapor chamber

Shi

Zhang

et al. 2019

J. Micromech. Microeng.

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In this paper, a novel ultra-thin flat heat pipe (UFHP) with an active steam chamber of 76 × 46 × 0.2 mm 3 is successfully designed, fabricated and tested. The innovation point of the UFHP is its thinner thickness with only 0.65 mm total thickness which can reduce the space for heat dissipation in electronic devices and accommodate its increasingly compact structure. Another innovation point is the design of supporting pillars. It is etched in the UFHP to avoid the ultra-thin chamber deformation and can also supply vertical channels for liquid reflux. Thermal performance is assessed and results reveal that the optimal operating power of the UFHP is 7.1-13.7 W at different tilt angles and liquid filling rates. When the filling rate is 1.05 and the tilt angle is 90 degrees, it has the best performance, and the minimum average thermal resistance is 1.15 °C W −1 with the input power varying from 7.1 to13.7 W. When the input power is 15.9 W and the evaporator temperature is 60 °C, the heat transfer performance of the vertically placed UFHP is perfect and with a thermal conductivity of 800 W m −1 K −1 . This research is of great significance for the production of UFHP with ultra-thin thickness and good heat transfer performance.

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Section: Introductionmentioning

confidence: 99%

Performance test of an ultra-thin flat heat pipe with a 0.2 mm thick vapor chamber

Shi

Zhang

et al. 2019

J. Micromech. Microeng.

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show abstract

“…Besides the previous researches, a number of studies regarding the design and performance evaluation of FHPs have also flourished lately . A review of the related literatures indicates that FHPs can spread heat rapidly and have the advantages of compactness and lightness. However, flat heat pipes for special applications, such as the application in multiple possible configurations where the heat sink may be out of plane with heat source , are very limited.…”

Section: Introductionmentioning

confidence: 99%

“…A review of the related literatures [6,7,[15][16][17][18][19][20][21] indicates that FHPs can spread heat rapidly and have the advantages of compactness and lightness. However, flat heat pipes for special applications, such as the application in multiple possible configurations where the heat sink may be out of plane with heat source [22], are very limited.…”

Section: Introductionmentioning

confidence: 99%

An Experimental Investigation of Thermal Performance of a Polymer‐Based Flat Heat Pipe

Shi

Wang

Shan

2015

Heat Trans. Asian Res.

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A polymer‐based flat heat pipe (PFHP) was fabricated. The heat transfer performance was measured and analyzed when deionized (DI) water and acetone were used as the working fluid, separately. Input power ranging from 2.8 W to 14.2 W was provided to the evaporator section while the device was at different filling ratios. Experimental results revealed that, when the polymer‐based flat heat pipe was laid in a horizontal position, the thermal resistance (1.02 K/W) was much smaller than that (4.6 K/W) of a copper plate with the same thickness at the thermal power of 10.3 W and the value decreased as the tilt angle changed from 0° to 90°.

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“…B. Mathew et al 8 reported a MEMS-based capillary heat exchanger for thermal harvesting; heat transfer tests were carried out and the results showed that the MEMS-based phase-change operations were comparable with or better than those of single-phase microchannel heat sinks. Chen Wang et al 9 14 performed a thermo-hydraulic study of fluid in open micro-channels etched in the inner surface of externally heated horizontal pipes containing two-phase flow from theory and experiments. MEMSbased MHPs are not similar to the MHPs shown above.…”

Section: Introductionmentioning

confidence: 99%

Thermal behavior investigation of silicon-Pyrex micro heat pipe

et al. 2014

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High heat flux is the major reason for the malfunctioning or shortened life of high-power light-emitting diodes (LEDs) or integrated circuit (IC) components. Cooling technical devices have been widely studied in recent years. A heat pipe made of silicon wafer and Pyrex 7740 has been used in the experiments. Silicon-to-Pyrex bonding is used for the visualization of the flow behavior of the working liquid in heat transfer. A thermal behavior testing system for micro heat pipes (MHPs), including a vacuum chamber, heat flux sensors and thermocouples, was designed and established. The experiments revealed the characteristics of the MEMS heat pipe in LEDs heat transfer, and the maximum equivalent thermal conductivity of the MHPs was 10.6 times that of the silicon wafer. Furthermore, the structure of MHP can be optimized based on these experimental results. They can also be the experimental basis for theoretical study of two-phase flow on the micro scale.

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Experimental Investigation on Thermal Performance of Flat Plate Heat Pipe with Intersected Micro-Grooves

Cited by 6 publications

References 10 publications

Performance test of an ultra-thin flat heat pipe with a 0.2 mm thick vapor chamber

Performance test of an ultra-thin flat heat pipe with a 0.2 mm thick vapor chamber

An Experimental Investigation of Thermal Performance of a Polymer‐Based Flat Heat Pipe

Thermal behavior investigation of silicon-Pyrex micro heat pipe

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