Experimental Measurements of Thermal Conductivity of Wood Species in China: Effects of Density, Temperature, and Moisture Content

Abstract

Experimental measurements of thermal conductivity of wood were performed using the heat flow meter and transient plane source technique. The specimens were prepared from five species of both softwoods and hardwoods widely available and used in China, with a wide range of density and moisture content. The transverse thermal conductivity of ovendry specimens is presented as a function of density and temperature up to 90°C and is compared with that along the grain direction for two select species. The influence of moisture content up to 23 percent, which is below the typical fiber saturation point of wood, on the transverse thermal conductivity is presented as well. It is shown that the transverse thermal conductivity of wood increases with density, temperature, and moisture content. Linear correlating equations are proposed in terms of these factors.

Measurements of Thermal and Dielectric Properties of Medium Density Fiberboard with Different Moisture Contents

“…1 based on the values of thermal diffusivity, specific heat capacity, and density. The effect of temperature on the thermal conductivities of 2.6-mm MDF with different moisture contents shows a similar pattern of double humps rather than a proportional pattern reported in most literature (Suleiman et al 1999;Yu et al 2011;Harada et al 1998;Lewis 1967). The thermal conductivity increased with temperature up to 50 ºC and then decreased with increasing temperature in the range of 50 to 100 ºC for the first hump.…”

Construction particleboards made from rapeseed straw glued with hybrid pMDI/PF resin

“…Expectedly, there is a close relationship between the density of investigated experimental particleboards and their thermal insulation. Heat-insulating properties of materials depend on numerous factors, such as density (Xu et al 2004), humidity (Yu et al 2011), thickness (Kawasaki and Kawai 2006;Sonderegger and Niemz 2009), ambient temperature, heat flow direction, size and geometry of particles and the board structure (Wei et al 2015;Cosereanu et al 2015). As Fig.…”

Determination of the effect of edge banding thickness and aging period on the MOR and MOE of melamine coated particle board using Taguchi method

“…Secondly, the temperature dependency of transverse thermal conductivity of the oven-dry specimens was calculated up to 90 °C. An almost linearly increasing trend was observed for each of the softwood and hardwood species between 30 °C and 80 °C [10].…”