2002
DOI: 10.1016/s0022-3093(02)00964-x
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Experimental observations of the thermal stability of high-k gate dielectric materials on silicon

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Cited by 62 publications
(23 citation statements)
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“…6 by the fact that the peak intensity of both films increases up to the same height and FWHM on annealing. A similar observation has been made by Lysaght et al, 33 in which 4 nm as-deposited ALD HfO 2 films grown on chemical oxide underlayers appear amorphous. Results in the same study 33 show that the percentage of the crystallinity achieved after annealing is independent of the as-deposited crystallinity.…”
Section: Resultssupporting
confidence: 85%
“…6 by the fact that the peak intensity of both films increases up to the same height and FWHM on annealing. A similar observation has been made by Lysaght et al, 33 in which 4 nm as-deposited ALD HfO 2 films grown on chemical oxide underlayers appear amorphous. Results in the same study 33 show that the percentage of the crystallinity achieved after annealing is independent of the as-deposited crystallinity.…”
Section: Resultssupporting
confidence: 85%
“…Correspondingly, interface performance enhancements of high-k/Si(1 0 0) systems have been realized [3], along with recent efforts to increase the permittivity of high-k materials through controlled incorporation of lanthanide series elements [4,5]. Central to all advanced dielectric film optimization endeavors has been the desire to circumvent crystallization of HfO 2 by alloying with Si and N to minimize adverse effects associated with precipitated impurity concentrations that may exacerbate leakage current pathways associated with grain boundary formation [6]. Concurrently, high resolution spectroscopic techniques capable of characterizing subtle film and interface stoichiometric variations as a function of gate stack layer deposition and subsequent anneal processing have emerged as critical requirements for the identification of microstructure driven mechanisms that limit the electrical performance of Hf-based complimentary metal oxide semiconductor (CMOS) devices [7].…”
Section: Introductionmentioning
confidence: 99%
“…deposited on silicon have shown presence of a silicon oxide interfacial layer [2]. Among these potential candidates, HfO 2 and its silicates and aluminates have been intensely studied because they exhibit good electrical properties and are thermally stable [3,4]. In previous studies, HfO 2 deposition has been carried out using metal organic chemical vapor deposition, jet vapor deposition, reactive sputtering, atomic layer deposition (ALD), and plasma enhanced ALD [2,[5][6][7][8].…”
Section: Introductionmentioning
confidence: 99%
“…In this work, HfO 2 films deposited by ALD of tetrakis(diethylamino)hafnium (Hf(DEA) 4 ) and moisture are characterized using angle resolved X-ray photoelectron spectroscopy (ARXPS), scanning transmission electron micrscopy (STEM), and electron energy loss spectroscopy (EELS). The results indicate that the HfO 2 /Si interface of the as-deposited ALD films are mostly free of silicate structure.…”
Section: Introductionmentioning
confidence: 99%