Experimental of ultra-high-power multichip COB LED

Hsu, Chih-Neng; Wang, Wei-Chuan; Fang, Shih-Hao

doi:10.1007/s10973-018-7806-6

Cited by 4 publications

(3 citation statements)

References 13 publications

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“…COB(Chips on Board) is a technology to solve the LED heat dissipation problem. The bare chip is attached to the interconnection substrate with conductive or non-conductive adhesive, and then the electrical connection is realized by lead bonding [8]- [9]. A COB strip is a strip that encapsulates the chip on a soft board.…”

Section: Introductionmentioning

confidence: 99%

Study on photothermal coupling of COB lamp belt

Jin¹,

Shen²,

Li³

et al. 2022

HSET

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With the rapid development of LED technology, the lighting effect of LED lamp belt in the atmosphere lamp has been unable to meet the needs of the modern market, and the COB lamp belt has gradually entered the public field of vision due to its advantages of high light uniformity, low junction temperature and large luminous Angle. In this paper, the stability, light uniformity, junction temperature and other performance of the two kinds of lamp belt under different color temperature and different power were analyzed by setting contrast experiment. It was found that LED lamp belt had uniform light and poor heat dissipation effect due to chip distribution characteristics, and it would accumulate a lot of heat and appear color shift phenomenon when continuously lit. The COB lamp belt can not only maximize the heat dissipation performance of the substrate, but also achieve more uniform light distribution by the way of multi-chip arrangement. The relationship between the thermal performance and chip spacing is analyzed by optimizing the design, which plays a guiding role in the actual production of the lamp belt

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Section: Introductionmentioning

confidence: 99%

Study on photothermal coupling of COB lamp belt

Jin¹,

Shen²,

Li³

et al. 2022

HSET

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“…2 COB is fixing LED chips to print circuit boards with high thermal conductivity directly, such as metal or ceramic base. It can package a large number of chips on a small luminous surface, which reduces the volume of LED and greatly improves the luminous flux, which is suitable for commercial lighting 3 …”

Section: Introductionmentioning

confidence: 99%

Research on high luminous efficiency, high color rendering index chips on board light emitting diode and excitation and excitation saturation effect of phosphor

Wen

Zhang

et al. 2021

Micro & Optical Tech Letters

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A kind of chips on board (COB) package of light emitting diode (LED) light source is designed and produced. By reducing the current density and using the mirror aluminum substrate with high reflectivity to improve the luminous efficiency. Meanwhile, three kinds of red phosphors with peak wavelength of 630 nm, 631 nm and 639 nm are added on the basis of yellow‐green phosphors, which increase within the range of red light LED spectrum composition, improve the LED color rendering index. The measurement results show that under 500 mA forward current, the luminous flux density of LED on the luminous surface with an area of 227 mm2 reaches 14.4 lm/mm2, the luminous efficiency reaches 175.5 lm/W, and the color rendering index reaches 89.3. It is found in the process of measuring the LED color temperature changes slightly with the current change, and by calculating that the proportion of blue photons in the LED spectrum is increasing gradually, the cause of this phenomenon is the phosphor excitation efficiency is saturation when the optical power density is high, which is influenced in two aspects: the proportion of photons absorbed by phosphor or the phosphor excitation efficiency decreases, the two factors together or separately cause the phosphor excitation saturation effect.

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“…(6,7) Since the heat transfer is still limited, some special high-thermal-conductivity materials or high cooling methods (8)(9)(10)(11)(12) should be used to enhance the efficiency. Therefore, some technologies, such as heat pipes, vapor chambers, refrigeration, air conditioning, sprays, phase materials, thermal pads, thermoelectric coolers, and microchannels, (13)(14)(15)(16)(17)(18)(19)(20)(21)(22)(23)(24) for assisting the cooling element to achieve heat dissipation and a special new technology to increase performance have been developed. Lee et al (25) proposed that graphene nanosheets of uniform shape may be incorporated into the silicon sealant for LEDs by solvent exchange.…”

Section: Introductionmentioning

confidence: 99%