Using Graphene-powder-based Thermal Interface Material for High Lumen LED Array Chip: An Experimental Study of Heat Dissipation

Hsu, Chih-Neng; Chen, Chun-Chih; Chang, Chenhui; Wang, Cheng‐Chi

doi:10.18494/sam.2020.3137

Cited by 3 publications

(3 citation statements)

References 9 publications

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“…High chip temperatures negatively affect the chip's efficiency, light output, performance, and lifetime. To solve the thermal problems of the LED arrays, different thermal management techniques such as thermoelectric coolers (TECs) (Li et al, 2011), heat pipes (Delendik et al, 2021;Lu et al, 2011), liquid cooling methods (Deng and Liu, 2010), and finned heat sinks (Hsu et al, 2020;Ye et al, 2011) have been suggested in the literature. (TECs) (Li et al, 2011), heat pipes (Delendik et al, 2021;Lu et al, 2011), liquid cooling methods (Deng and Liu, 2010), and finned heat sinks (Hsu et al, 2020;Ye et al, 2011) have been suggested in the literature.…”

Section: Introductionmentioning

confidence: 99%

“…To solve the thermal problems of the LED arrays, different thermal management techniques such as thermoelectric coolers (TECs) (Li et al, 2011), heat pipes (Delendik et al, 2021;Lu et al, 2011), liquid cooling methods (Deng and Liu, 2010), and finned heat sinks (Hsu et al, 2020;Ye et al, 2011) have been suggested in the literature. (TECs) (Li et al, 2011), heat pipes (Delendik et al, 2021;Lu et al, 2011), liquid cooling methods (Deng and Liu, 2010), and finned heat sinks (Hsu et al, 2020;Ye et al, 2011) have been suggested in the literature. Among these methods, passive thermal management via finned heat sinks is preferred the most since no extra parts such as fans and/or pumps as well as cooling liquids are required (Feng et al, 2018).…”

Section: Introductionmentioning

confidence: 99%

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Generalized Thermal Optimization Method for the Plate-Fin Heat Sinks of High Lumen Light Emitting Diode Arrays

Kundakçıoğlu,

Dönmezer Akgün

2024

Isı Bilimi Ve Tekniği Dergisi

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The performance of high-lumen light-emitting diode (LED) arrays is strongly affected by high temperatures. For better performance, the design of better thermal management techniques is required. In this work, an analytical thermal optimization algorithm for the passive heat sinks of high-lumen LED arrays is presented. With the aid of this algorithm, a broader range of heat sink geometry alternatives can be explored for the identification of the optimal heat sink design. This task is challenging using experimental or numerical techniques. The results demonstrate that the algorithm yields design with a reduction of more than 30% in base temperatures compared to previous heat sink design studies when minimum mass and maximum total efficiency constraints are applied. For devices with high powers, small chip spacing, and space limitations in the horizontal axis where base temperatures cannot be further reduced using these constraints, minimum temperature optimization can result in up to a 17% reduction in base temperatures. This reduction in base temperatures significantly improves the junction temperatures and the overall lighting quality of the LEDs.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Generalized Thermal Optimization Method for the Plate-Fin Heat Sinks of High Lumen Light Emitting Diode Arrays

Kundakçıoğlu,

Dönmezer Akgün

2024

Isı Bilimi Ve Tekniği Dergisi

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“…The second involves using hybrid fillers to decrease the interfacial thermal resistance by coating two-dimensional materials such as carbon nanotubes (CNTs), graphene, and boron nitride on the surface of spherical ceramic fillers. By attaching two-dimensional materials, it is expected that contact areas among inorganic fillers will increase from point-to-point contact to plane-to-plane contact [ 13 , 14 , 15 , 16 ].…”

Section: Introductionmentioning

confidence: 99%

The Effect of Porosity on the Thermal Conductivity of Highly Thermally Conductive Adhesives for Advanced Semiconductor Packages

Choi¹,

Park²,

Lee³

2023

Polymers

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This study suggests promising candidates as highly thermally conductive adhesives for advanced semiconductor packaging processes such as flip chip ball grid array (fcBGA), flip chip chip scale package (fcCSP), and package on package (PoP). To achieve an extremely high thermal conductivity (TC) of thermally conductive adhesives of around 10 Wm−1K−1, several technical methods have been tried. However, there are few ways to achieve such a high TC value except by using spherical aluminum nitride (AlN) and 99.99% purified aluminum oxide (Al2O3) fillers. Herein, by adapting highly sophisticated blending and dispersion techniques with spherical AlN fillers, the highest TC of 9.83 Wm−1K−1 was achieved. However, there were big differences between theoretically calculated TCs that were based on the conventional Bruggeman asymmetric model and experimentally measured TCs due to the presence of voids or pores in the composites. To narrow the gaps between these two TC values, this study also suggests a new experimental model that contains the porosity effect on the effective TC of composites in high filler loading ranges over 80 vol%, which modifies the conventional Bruggeman asymmetric model.

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A review on thermal management of light-emitting diodes: From package-level to system-level

Li,

Tan,

et al. 2024

Applied Thermal Engineering

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Using Graphene-powder-based Thermal Interface Material for High Lumen LED Array Chip: An Experimental Study of Heat Dissipation

Cited by 3 publications

References 9 publications

Generalized Thermal Optimization Method for the Plate-Fin Heat Sinks of High Lumen Light Emitting Diode Arrays

Generalized Thermal Optimization Method for the Plate-Fin Heat Sinks of High Lumen Light Emitting Diode Arrays

The Effect of Porosity on the Thermal Conductivity of Highly Thermally Conductive Adhesives for Advanced Semiconductor Packages

A review on thermal management of light-emitting diodes: From package-level to system-level

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