2020
DOI: 10.1080/01694243.2020.1763540
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Experimental study of the CTBN effect on mechanical properties and mode I and II fracture toughness of a new epoxy resin

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Cited by 19 publications
(11 citation statements)
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“…The significant tensile properties calculated from these curves are presented in Table 4 and Table 5. It is well known from the literature [10,13,15,29,30] that modification of epoxy with rubber decreases the tensile strength and elasticity modulus. Generally, this reduction is attributed to the low modulus of elasticity of the rubber phase and the reduction of the crosslink density of the epoxy during curing.…”
Section: Tensile Propertiesmentioning
confidence: 99%
“…The significant tensile properties calculated from these curves are presented in Table 4 and Table 5. It is well known from the literature [10,13,15,29,30] that modification of epoxy with rubber decreases the tensile strength and elasticity modulus. Generally, this reduction is attributed to the low modulus of elasticity of the rubber phase and the reduction of the crosslink density of the epoxy during curing.…”
Section: Tensile Propertiesmentioning
confidence: 99%
“…Epoxy adhesive is widely used as a structural adhesive. However, in its neat formulation, it undergoes brittle fracturing, with a low fracture toughness, which represents a significant limitation for its application in the structural field [11,12]. Joints bonded with brittle epoxy adhesive are defect-sensitive and exhibit broad strength dispersion due to scatter in flaw sizes.…”
Section: Introductionmentioning
confidence: 99%
“…In the modern polymer industry, epoxy resins (EPs) are widely used in many elds such as transportation, aerospace, electronic packing materials, and coatings owing to their superior tensile strength, chemical stability, and strong cohesiveness. [1][2][3][4] However, neat EP with high ammability can easily result in a re risk, which restricts its use in specic elds. Hence, it is important to reduce the re risk of EP to further broaden its engineering applications.…”
Section: Introductionmentioning
confidence: 99%