Experimental Study of Thermal Contact Resistance in Hardened Bearing Surfaces

Babu, S. S.; Manisekar, K.; Kumar, A. P. Senthil; Rajenthirakumar, D.

doi:10.1080/08916152.2013.860503

Cited by 12 publications

(3 citation statements)

References 16 publications

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“…These results were verified with the experimental results obtained using conventional method. A detailed design and fabrication of test rig, LMMB set, material selection and their application are discussed in [3,4]. A set of LMMB was used; a ball was cleaned and stochastic pattern was prepared and placed on the bottom raceway.…”

Section: Methodsmentioning

confidence: 99%

Static and Localized Strain Analysis of High Hardened Linear Model Mock-Up Bearing for Fast Breeder Reactor

Babu

Manisekar

2015

MSF

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This paper investigates the impact of strain sensitivity on the linear model mock-up bearing (LMMB) using digital image correlation (DIC) technique. This work addresses the lack of norms, standards, reference of elastic/plastic deformation of bearings elements. Towards that, experimental set-up was designed and fabricated with a set of LMMB (AISI4140) with commercially purchased steel balls (AISI52100) to study the raceway relative approach and localized strain rate on steel ball, wherein raceway relative approach is measured using LVDT & screw gauge and results are compared with DIC results. These data are very much useful in design and development of large diameter slewing bearing for fast breeder reactor and also these results can be used to optimize the number of ball, load, and tolerance on bearing.

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Section: Methodsmentioning

confidence: 99%

Static and Localized Strain Analysis of High Hardened Linear Model Mock-Up Bearing for Fast Breeder Reactor

Babu

Manisekar

2015

MSF

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“…where h c is the TCC coefficient; T ext is the temperature of the phantom, (assumed to be constant, 37°C in our case); T is the temperature of the scan head surface; q 0 is the heat flux. The TCC coefficient is the inverse of the thermal contact resistance [31,32]. Values for TCC coefficients were determined by comparing the simulated and measured steady-state surface temperatures, as detailed in the section 3.2 Calibration of the simulation model.…”

Section: Simulation Of Steady-state Heat Transfermentioning

confidence: 99%

Thermal management of an interventional medical device with double layer encapsulation

Duyen

Andreassen

Edwardsen³

et al. 2021

Experimental Heat Transfer

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This paper presents a thermal study of a double-layer encapsulation for an interventional medical device, which operates temporarily inside the human esophagus for cardiac imaging. The surface temperature of test samples, representing the device, was assessed by experiments and numerical simulations. The test samples consisted of a heat source, a heat sink and a doublelayer encapsulation consisting of a 3D printed biocompatible polymer (thickness 0.9 mm), with an electroplated Cu inner layer (0, 10, 80 or 150 µm thick). The surface temperature of test samples was measured in a tissue-mimicking thermal phantom at 37°C, with different heat source power levels. Experimental results showed that the maximum steady-state surface temperature could be reduced significantly by a 10 µm thick Cu layer (compared to no Cu layer). Increasing the Cu layer thickness further had a rather small effect, at least for low power levels. The maximum steady-state surface temperature was an exponential function of the Cu layer thickness. Test samples with a Cu electroplated polymer encapsulation and a heat source power of 0.5 W satisfied the maximum temperature limit for thermal safety (43°C) when the Cu layer was thicker than about 80 µm. Simulated surface temperatures were in good agreement with experimental values, for a model using two different thermal contact conductance coefficients (for different materials) for the sample-phantom boundary condition. The simulation model was also used to suggest alternative materials for the outer layer of an encapsulation with a metal inner layer, for reducing the surface temperature.

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“…Thermal contact resistance exists in all the contact interface of various thermal structures due to the imperfect contact at the interface, since microscopic and macroscopic irregularities are present in all practical surfaces, and the actual area of contact for most metallic surfaces is only a small portion (about 1–2%) of the nominal contact area[ 7 ]. Thermal contact resistance has been widely studied in terms of theory, computation and experiment recently[ 8 – 16 ], while almost all the previous work mainly focus on low temperature or medium temperature (interface temperature less than 300°C), and interface temperature of the thermal protection structures of heat-pipe-cooled leading edges could reach as high as 500°C. At the same time, it is desirable for heat-pipe-cooled leading edges to reduce the interface thermal contact resistance, so that the stagnation heat can pass the structure interface easily to reach to the surface of the embedded heat pipe.…”

Section: Introductionmentioning

confidence: 99%

Numerical simulation of high-temperature thermal contact resistance and its reduction mechanism

Liu

Zhang

2018

PLoS ONE

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High-temperature thermal contact resistance (TCR) plays an important role in heat-pipe-cooled thermal protection structures due to the existence of contact interface between the embedded heat pipe and the heat resistive structure, and the reduction mechanism of thermal contact resistance is of special interests in the design of such structures. The present paper proposed a finite element model of the high-temperature thermal contact resistance based on the multi-point contact model with the consideration of temperature-dependent material properties, heat radiation through the cavities at the interface and the effect of thermal interface material (TIM), and the geometry parameters of the finite element model are determined by simple surface roughness test and experimental data fitting. The experimental results of high-temperature thermal contact resistance between superalloy GH600 and C/C composite material are employed to validate the present finite element model. The effect of the crucial parameters on the thermal contact resistance with and without TIM are also investigated with the proposed finite element model.

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Experimental Study of Thermal Contact Resistance in Hardened Bearing Surfaces

Cited by 12 publications

References 16 publications

Static and Localized Strain Analysis of High Hardened Linear Model Mock-Up Bearing for Fast Breeder Reactor

Static and Localized Strain Analysis of High Hardened Linear Model Mock-Up Bearing for Fast Breeder Reactor

Thermal management of an interventional medical device with double layer encapsulation

Numerical simulation of high-temperature thermal contact resistance and its reduction mechanism

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