Experimental testing and computational stress analysis of printed circuit board for the failure prediction of passive components under the depaneling load condition

Lau, David Tai-Wai; Tsang, Mei Sze; Lee, S.W.R.; Lo, Jeffery C. C.; Fu, Lifong; Jin, Jiwen; Liu, Sang

doi:10.1109/ectc.2005.1442037

Cited by 7 publications

(10 citation statements)

References 4 publications

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“…This can be observed in the stress contour of PCB model without hole in Fig7(a).The dispersion of the stress along the width and length direction of the PCB plates may kindle strain to the solder joints of the mounted components. The solder joints may crack due to the induce stress if the bending effect is extended for a long period of time [3]. Hence, the through hole is placed from the constrained area of the PCB to focus the stress distribution area to the hole structure as shown in Fig 7(b)where high stress is induced at the periphery of the hole structure.…”

Section: Fixed Supportmentioning

confidence: 99%

“…The mechanical bending exerts a curvature bend exist on the PCB plates during the depaneling process [3]. During the bending motion, the stress is induced on the constrained area of the PCB plate.…”

Section: Fixed Supportmentioning

confidence: 99%

“…The mechanical bending process may induce stress on the PCBs which may damage and reduce the reliability of the PCBs [3,4]. There are previous simulation work reported on reliability characterization of PCB [5,6] Therefore, the stress induced by the PCB plates during the bending process and methods to manage the stress distribution have to be examined.…”

Section: Introductionmentioning

confidence: 99%

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Stress Analysis on Through Holes in PCB

Sauli

Retnasamy

Vengdasalam

et al. 2012

2012 Fourth International Conference on Computational Intelligence, Modelling and Simulation

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Printed circuit board (PCB), assembly process is developing in a rapid pace. These PCBs are utilized in a heavily in the electronic manufacturing industry. During assembly process, the PCB plates are subjected to mechanical loads such as bending which induces stress distribution on the PCB plates. In this paper, a study on the printed circuit board (PCB) plates during bending process was done. Ansys software was used to evaluate the stress response on the PCB plates during the bending process. Two 3D dimensional PCB plate models, one with through hole and one without hole were developed for the simulation. The stress responses from both these models were compared. Simulation results showed that the value of stress response of the PCB increases with increasing displacement. The through hole PCB model exhibited higher stress compared to the without hole PCB model. Highest stress response was obtained at the displacement height of 5cm.

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Section: Fixed Supportmentioning

confidence: 99%

Section: Fixed Supportmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Stress Analysis on Through Holes in PCB

Sauli

Retnasamy

Vengdasalam

et al. 2012

2012 Fourth International Conference on Computational Intelligence, Modelling and Simulation

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“…Hence, by comparing the over all results, the PCB plate with hole exhibited higher stress response compared to the PCB plate without hole. During the depaneling process, a curvature bend exist on the PCB plates due to the mechanical bending [3]. When PCB plate experiences the bending motion, stress is induced on the opposite side of the PCB plates which distributes along the width and length direction of the PCB plates [7].…”

Section: Without Hole With Holementioning

confidence: 99%

“…The mechanical bending process may induce stress on the PCBs which may damage and reduce the reliability of components mounted on the PCBs [3,4]. The depaneling process causes movement between the mounted components and the board which will damage the solder joint of the components [5,6] .…”

Section: Introductionmentioning

confidence: 99%

Single hole at constrained location for stress analysis in PCB plate bending

Sauli

Retnasamy

Vengdasalam

et al. 2012

2012 10th IEEE International Conference on Semiconductor Electronics (ICSE)

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In this paper, simulation on the bending process of PCB during depaneling was done. The stress response during the bending process was evaluated using a computational program Ansys version 11. Two PCB plate model were developed:one of the model with single hole and other model without hole. The stress responce of the two models were then compared. From the simulation, it has been observed that the value of stress response of the PCB increases with increasing displacement height. The PCB model with single hole exhibited higher stress compared to the PCB model without hole. Highest stress response was obtained at the displacement height of 5cm for both models.

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