Experimental verification and analysis of analytical model of the shape of bond wire antennas

Ndip, Ivan; Huhn, M.; Brandenburger, F.; Ehrhardt, Christian; Schuster, Martin; Reichl, H.; Lang, Klaus‐Dieter; Henke, Heino

doi:10.1049/el.2016.3673

Cited by 8 publications

(4 citation statements)

References 7 publications

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“…The reported studies specify that a bond ribbon could form a series inductor, contributing to drastically increasing losses, especially when the frequency or the bond ribbon length increases. For that reason, many efforts have focused on reducing the length of the bond ribbon, as well as reducing the chip-to-package gap to improve the interconnectivity performance at millimeter-wave frequencies [ 10 , 11 , 12 ].…”

Section: Manufacturing Tolerance Analysis Of the Gold-bonding Ribbonmentioning

confidence: 99%

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Tolerance Considerations for MHMIC Manufacturing Process at Millimeter-Wave Band

Hannachi,

Egels,

Pannier

et al. 2024

Sensors

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This paper investigates the manufacturing uncertainties at a 60 GHz millimeter-wave band for the monolithic hybrid microwave integrated circuits (MHMIC) fabrication process. It specifically deals with the implementation tolerances of thin-film gold microstrip transmission lines, titanium oxide thin-layer resistors, microstrip quarter-wavelength radial stubs, and active device implementation using the gold-bonding ribbons. The impacts of these manufacturing tolerances are assessed and experimentally quantified through prototyped MHMIC circuits. This allows us, on one hand, to identify the acceptable amount of dimensional variation enabling reasonable performances. On the other hand, it aims to establish a relationship between the manufacturing tolerances and the circuit parameters to provide more flexibility for the tolerance compensation and accuracy enhancement of the MHMIC fabrication processes.

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Section: Manufacturing Tolerance Analysis Of the Gold-bonding Ribbonmentioning

confidence: 99%

“…They are mostly implemented on less expensive and low-loss thin-film alumina ceramic substrates [ 9 ]. However, active devices or elements are connected to the circuits separately with wire or ribbon bonds since they are not formed in or on the substrate [ 10 , 11 , 12 , 13 ].…”

Section: Introductionmentioning

confidence: 99%

Tolerance Considerations for MHMIC Manufacturing Process at Millimeter-Wave Band

Hannachi,

Egels,

Pannier

et al. 2024

Sensors

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“…Although ground terminal is very crucial in antenna transmission range, in this specific design, the ground plays a dominant role. The length of the wire has no effect on the wavelength of the radio used, but for convenience instead [ 41 , 42 ]. The wire can be straight or strung forth and back between walls and trees.…”

Section: Antenna Overviewmentioning

confidence: 99%

The Recent Advancement in Unmanned Aerial Vehicle Tracking Antenna: A Review

Kelechi¹,

Alsharif

Oluwole³

et al. 2021

Sensors

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Unmanned aerial vehicle (UAV) antenna tracking system is an electromechanical component designed to track and steer the signal beams from the ground control station (GCS) to the airborne platform for optimum signal alignment. In a tracking system, an antenna continuously tracks a moving target and records their position. A UAV tracking antenna system is susceptible to signal loss if omnidirectional antenna is deployed as the preferred design. Therefore, to achieve longer UAV distance communication, there is a need for directional high gain antenna. From design principle, directional antennas are known to focus their signal energy in a particular direction viewed from their radiation pattern which is concentrated in a particular azimuth direction. Unfortunately, a directional antenna is limited by angle, thus, it must always be directed to the target. The other limitation of a UAV mechanical beam steering system is that the system is expensive to maintain and with low reliability. To solve this problem, we are proposing the use of MIMO technology as a readily available technology for UAV beyond line of sight technology. Although UAV antenna tracking is domiciled in the mechanical beam steering arrangement, this study shows that this native technology could be usurped by MIMO beam forming.

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“…(2) the wiring form of bonding wire including wire spacing, signal pin distribution, interconnection etc., [8][9][10][11]; (3) the overall package design such as grounding copper cover, through silicon vias (TSV) technology, and the redistribution layer (RDL) of flip chip or the like [12][13][14][15]. Zhang analyzed the influence of bonding wire on parasitic parameters under different span and arch height.…”

Section: Introductionmentioning

confidence: 99%

Analysis and Experimental Test of Electrical Characteristics on Bonding Wire

Tian

Cui

2019

Electronics

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In this paper, electrical characteristic analysis and corresponding experimental tests on gold bonding wire are presented. Firstly, according to EIA (Electronic Industries Association)/JEDEC97 standards, this paper establishes the electromagnetic structure model of gold bonding wire. The parameters, including flat length ratio, diameter, span and bonding height, were analyzed. In addition, the influence of three kinds of loops of bonding wire is discussed in relation to the S parameters. An equivalent circuit model of bonding wire is proposed. The effect of bonding wire on signal transmission was analyzed by eye diagram as well. Secondly, gold bonding wire design and measurement experiments were implemented based on radio frequency (RF) circuit theory analysis and test methods. Meanwhile, the original measurement data was compared with the simulation model data and the error was analyzed. At last, the data of five frequency points were processed to eliminate the fixture error as much as possible based on port embedding theory. The measurement results using port extension method were compared with the original measurement data and electromagnetic field simulation data, which proved the correctness of the simulation results and design rules.

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Experimental verification and analysis of analytical model of the shape of bond wire antennas

Cited by 8 publications

References 7 publications

Tolerance Considerations for MHMIC Manufacturing Process at Millimeter-Wave Band

Tolerance Considerations for MHMIC Manufacturing Process at Millimeter-Wave Band

The Recent Advancement in Unmanned Aerial Vehicle Tracking Antenna: A Review

Analysis and Experimental Test of Electrical Characteristics on Bonding Wire

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