2001
DOI: 10.1016/s0927-0248(00)00156-2
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Experiments on anisotropic etching of Si in TMAH

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Cited by 77 publications
(38 citation statements)
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“…Note the thickness of Al over-layer for the carrier lifetime samples was controlled to be thin (< 10 nm) to mimic a contact, whilst still transmitting sufficient light for the photo-conductance measurement.Proof-of-concept cells were fabricated on n-type c-Si wafers with a resistivity of ~0.5 Ω·cm and a thickness of ~230 µm. The as-cut (100)-oriented silicon wafers were subjected to an alkaline solution of TMAH, deionized water, isopropyl alcohol (IPA) and dissolved silicon at a temperature of 85 °C for 60 min, forming textured morphologies with an array of random pyramids [50][51][52][53][54]. After cleaning all samples by the RCA procedure, full-area boron diffusion with sheet resistance of ~120 Ω/□ was then performed in a dedicated clean quartz furnace.…”
mentioning
confidence: 99%
“…Note the thickness of Al over-layer for the carrier lifetime samples was controlled to be thin (< 10 nm) to mimic a contact, whilst still transmitting sufficient light for the photo-conductance measurement.Proof-of-concept cells were fabricated on n-type c-Si wafers with a resistivity of ~0.5 Ω·cm and a thickness of ~230 µm. The as-cut (100)-oriented silicon wafers were subjected to an alkaline solution of TMAH, deionized water, isopropyl alcohol (IPA) and dissolved silicon at a temperature of 85 °C for 60 min, forming textured morphologies with an array of random pyramids [50][51][52][53][54]. After cleaning all samples by the RCA procedure, full-area boron diffusion with sheet resistance of ~120 Ω/□ was then performed in a dedicated clean quartz furnace.…”
mentioning
confidence: 99%
“…Besides the same 1.0 Ω cm n-type, {100}-oriented wafers used in Section 3.1, lifetime samples for Section 3.2 also includes (i) {111}-oriented planar n-type FZ silicon wafers with a resistivity of 1.0 Ω cm and a thickness of 290 mm, and (ii) textured silicon wafers with random upright pyramids, which were prepared by immersing the as-cut 1.0 Ω cm n-type, {100} samples in an alkaline solution of TMAH, deionized water, isopropyl alcohol (IPA) and dissolved silicon at a temperature of 85°C for 60 min [12][13][14][15][16]. In addition, Section 3.2 also includes planar and random pyramidally textured boron-diffused samples with three different sheet resistances of 56, 122, and 214 Ω/sq.…”
Section: Methodsmentioning
confidence: 99%
“…More details about the fabrication process of the textured Si surfaces can be found elsewhere. [34][35][36][37][38][39][40][41][42] 043502-2 Mehrabian et al…”
Section: Modelmentioning
confidence: 99%