Experiments on interaction of liquid tin with solid copper

Snugovsky, L.; Ruggiero, M. A.; Perović, D. D.; Rutter, J. W.

doi:10.1179/026708303225002794

Cited by 18 publications

(14 citation statements)

References 2 publications

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“…Accordingly, the dissolution behavior changes with the changing concentration of Cu in the solder. It was indeed confirmed by Snugovsky et al [28] that the effect of solder volume could not be ignored. The amount of copper dissolved was measured as a function of time and temperature for the case of limited Sn volume [28].…”

Section: Introductionmentioning

confidence: 59%

“…In other words, the 760 m solder joints reached Cu saturation in just one reflow regardless of what the initial Cu concentration was in solders. Nevertheless, The Cu solubility is a function of temperature [28]. Accordingly, the w Cu is also a function of temperature, and, to a first approximation, can be read from the Cu-Sn binary phase diagram.…”

Section: Discussionmentioning

confidence: 99%

“…However, the precise measurement of Cu consumption is not emphasized. There are only a few studies on the dissolution of the Cu layer of surface finishes [4,6,[23][24][25][26][27][28]. It was found that with a 0.5 wt.% Cu addition in Sn3.5Ag, the Cu dissolution rate slowed down dramatically [6].…”

Section: Introductionmentioning

confidence: 98%

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The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering

Chang

Lin

Wang

et al. 2010

Journal of Alloys and Compounds

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Section: Introductionmentioning

confidence: 59%

Section: Discussionmentioning

confidence: 99%

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The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering

Chang

Lin

Wang

et al. 2010

Journal of Alloys and Compounds

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“…Interfacial interaction between solid and liquid metals is of importance in the technology of materials surface treatment and metallurgy process, such as hot dip galvanizing, welding, smelting and so on [1][2][3] . Recently, the smelting process of Zn-Ni master alloys is developed to be suitable for Technigalva [4] which has been widely used in batch hot dip galvanizing, and nickel-based pretreatments has been studied to solve the problems of hot dip galvanizing on high silicon steel (>0.25%Si) [5] .…”

Section: Introductionmentioning

confidence: 99%

Interfacial reaction between solid nickel and liquid zinc

Kong

2008

J. Wuhan Univ. Technol.-Mat. Sci. Edit.

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Interfacial reactions between solid nickel and liquid zinc at 450-650 ℃ for 30-600 s were studied. The morphology and growth behavior of intermetallic compound layers at the interface between solid nickel and liquid zinc were observed and analyzed by SEM and EDS. The results show thatγand δ phases are formed at 450 ℃ at the Ni/Zn interface, and at 550 and 650 ℃ ℃ onlyγphase is formed at the interface and someδ phase particles will be participated during solidification on the surface ofγphase layer. Theβ 1 phase is absent under experimental conditions. Many cracks occur in the layers due to the difference in thermal expansion coefficients of these phases. It is found that the kinetics of the intermetallic compounds growth follows a parabolic law of time, as controlled by the diffusion mechanism. The apparent activation energies are 113.9 kJ/mol for the growth ofγphase and 125.87 kJ/mol forγ 1 phase, respectively.

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“…During the liquidsolid interaction of molten solder and Cu substrate, it is believed that a rapid dissolution of Cu into molten solder with a lower Cu concentration occurs immediately after the Cu oxide film has been removed by the actions of the flux. This rapid direct dissolution of Cu occurs until the conditions become favorable for the nucleation and growth of IMCs such as ƞ-Cu6Sn5 and ɛ-Cu3Sn [90][91][92]. The formation of interfacial IMC layers are based on two main reactions: (i) dissolving of the metal substrate into the molten metal and (ii) bonding of the active constituent elements in solder material with the substrate material [93].…”

Section: Interfacial Intermetallic Compound (Imc) Layer Of Reinforcedmentioning

confidence: 99%

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

Salleh¹,

Anuar²

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Electronics manufacturers are pushing the limits in reducing the physical size of circuitry while simultaneously increasing the number of transistors to satisfy Moore's Law [1]. This includes investing in new materials, and configuring new ways to manufacture complex 3D (three dimensional) electronic packaging [1]. One key requirement of new materials and techniques is ensuring the high reliability of the resultant products in various challenging operating environments including thermal and mechanical extremes [2][3][4]. A viable method to enhance the properties and performance of a solder joint is by incorporation of reinforcement particles to the solder matrix, either by intrinsic or extrinsic methods. In this thesis a series of Sn-Cu Pb-free solder alloys with extrinsic or intrinsic phase reinforcement were manufactured and the microstructure and soldering behavior were investigated in detail.Additions of extrinsic reinforcement in the form of nano-sized ceramic material were made using a microwave sintering powder metallurgy (PM) method, which is a viable method to improve the mechanical and thermal properties of Pb-free solder materials. In addition, the advanced processing routes ensures a homogenous distributions of reinforcement particles is present. To investigate the performance of the reinforced bulk solders including thermal and mechanical properties and relate this to the microstructure, samples were investigated using techniques such as synchrotron micro-XRF, HRTEM, SEM, XPS, dilatometery, DSC and shear and microhardness testing. A hypothesis of how reinforcement improves solder properties is developed and discussed. Synchrotron X-ray radiography imaging (SXRI) was used to analyse the development of microstructure and the complex interactions occurring in the solders. Based on the properties of the fabricated solder, the microwave sintering PM route was discussed as a promising method for the reinforcement of Pb-free solders.The initial formation of interfacial IMC products was studied in Sn-Cu based solder alloys by in situ experiment techniques such as SXRI and UHV-TEM. The results provide direct experimental evidence of real-time initial Cu6Sn5 layer development during soldering and also the stress creation and release events that arise due to the polymorphic transformations of the Cu6Sn5 phase and the associated volumetric change.ii In addition, the nucleation and growth behavior of primary intermetallics which can be considered an intrinsic reinforcing material in solder joints was studied. Here, the nucleation and growth behavior of primary Cu6Sn5 and β-Sn crystals in some of the most commonly used solder alloys including Sn-0.7Cu and Sn-3.0Ag-0.5Cu is explained. This also includes the effects of Ni additions for refining primary Cu6Sn5 in Sn-Cu solder joints. Using SXRI, observations were made during solder joint solidification, which is difficult using conventional methods. The initial nucleation and solidification kinetics of primary Cu6Sn5 crystals were discussed.The growth of pri...

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Experiments on interaction of liquid tin with solid copper

Cited by 18 publications

References 2 publications

The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering

The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering

Interfacial reaction between solid nickel and liquid zinc

Microstructure Formation in Reinforced Sn-Cu Lead-free Solder Alloys

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