Exploring microstencils for sub-micron patterning using pulsed laser deposition

Vroegindeweij, F.; Speets, Emiel A.; Steen, J; Brugger, Jürgen; Blank, David H.A.

doi:10.1007/s00339-004-2749-0

Cited by 23 publications

(13 citation statements)

References 7 publications

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“…Although the nanostencil lithography has been used for forming various structures such as nanodots, 13 nanobridges, and nanocantilevers, 14 all of those patterns were the combination of only isolated filled polygons. By using the reverse process, however, we could also produce an array of pores because reversed patterns have isolated empty shapes ͓Fig.…”

Section: Resultsmentioning

confidence: 99%

Reverse transfer of nanostencil patterns using intermediate sacrificial layer and lift-off process

Park

Vazquez-Mena

Boogaart

et al. 2006

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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We propose a new process by which patterns produced by nanostencil lithography can be reversed, so that the final pattern on the substrate has the same contrast ͑filled or empty͒ as that of the stencil. In this process, the stencil pattern is first formed on an intermediate sacrificial layer, and then transferred onto the underlying substrate in a reverse manner. Using this process, we can form various pattern structures that cannot be produced by the normal stencil process, such as an array of pores or multiple parallel bridges. Because a bridge in the stencil is transferred also as a bridge on the substrate, we can not only avoid the widening of a narrow bridge pattern by the stress-induced bending of the membrane, but also reduce the width of the bridge even further using the pattern blurring. Using SiO 2 as an intermediate layer, we have fabricated various reversed Cr patterns on Si, including an array of 800 nm circular pores and a 100-nm-wide and 150-nm-long nanobridge.

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Section: Resultsmentioning

confidence: 99%

Reverse transfer of nanostencil patterns using intermediate sacrificial layer and lift-off process

Park

Vazquez-Mena

Boogaart

et al. 2006

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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“…The possibilities of sub-micron patterning by means of microstencils using PLD have been investigated by one of the authors [22]. Stencils with circular and elliptical patterns were used, with apertures ranging from 1 µm down to 500 nm.…”

Section: Comparison Of Evaporation Sputtering and Pld Through Nanostmentioning

confidence: 99%

MEMS tools for combinatorial materials processing and high-throughput characterization

Ludwig

Cao

Brugger

et al. 2004

Meas. Sci. Technol.

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Using the combinatorial material synthesis approach, materials libraries can be produced in one experiment that contain up to several thousand samples on a single substrate. In order to identify optimized materials in an efficient way using screening methods, adequate automated material characterization tools have to be designed and applied. Microsystems (micro-electromechanical systems: MEMS) offer powerful tools for the fabrication and processing of materials libraries as well as for accelerated material characterization on planar substrates such as Si wafers. MEMS can be used for parallel materials processing, either as passive devices such as shadow mask structures, or as active devices such as micro-hotplates. Microstructured wafers, which incorporate sensor or actuator structures such as electrode or cantilever arrays, can be used to identify materials properties in an efficient way.

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“…Most of the work focused so far on metal patterning by evaporation [15]- [22] and lately by pulsed laser deposition (PLD) [23], [24]. More recently, results on organic materials [25] and complex oxide materials [26], [27] were also reported.…”

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confidence: 99%

Nanostenciling of Functional Materials by Room Temperature Pulsed Laser Deposition

Cojocaru

Harnagea

Pignolet

et al. 2006

IEEE Trans. Nanotechnology

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Abstract-We present how various features drawn in a miniature shadow mask (nanostencil) can be efficiently transferred to a surface in the form of three-dimensional nanostructures of metals (Pt, Cr), semiconductors (Ge), and complex oxides (e.g., BaTiO 3 ) by room temperature pulsed laser deposition. Selective deposition is obtained by interposing a sieve with apertures down to 100 nm between source and substrate. Nanostenciling allows for the organization of structures in predefined architectures with high accuracy. The patterning process is simple and rapid, since it does not imply additional processing steps. It is also parallel, resistless, and does not interfere with the structures' growth dynamics. The material deposited through the stencil mask conserves the desired functionality even at the level of the individual nanostructures. Nanostenciling can be performed in high or ultrahigh vacuum and is suitable for parallel prototyping of fragile or functionalized surfaces.Index Terms-Atomic force microscopy, functional materials, nanostencils, pulsed laser deposition, unconventional patterning approaches.

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Exploring microstencils for sub-micron patterning using pulsed laser deposition

Cited by 23 publications

References 7 publications

Reverse transfer of nanostencil patterns using intermediate sacrificial layer and lift-off process

Reverse transfer of nanostencil patterns using intermediate sacrificial layer and lift-off process

MEMS tools for combinatorial materials processing and high-throughput characterization

Nanostenciling of Functional Materials by Room Temperature Pulsed Laser Deposition

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