MEMS tools for combinatorial materials processing and high-throughput characterization

Ludwig, Alfred; Cao, J.; Brugger, Jürgen; Takeuchi, Ichiro

doi:10.1088/0957-0233/16/1/015

Cited by 65 publications

(35 citation statements)

References 52 publications

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“…16). Stencil masks can be cleaned by wet-chemical etching or dry plasma cleaning of the unwanted deposited material [29]. Clogging during the deposition imposes a limit to the amount of material that can be deposited in a single process step using stencils.…”

Section: Clogging Phenomenon: Empirical and Theoretical Characterizationmentioning

confidence: 99%

Predicting mask distortion, clogging and pattern transfer for stencil lithography

Lishchynska¹,

Bourenkov²,

Boogaart

et al. 2007

Microelectronic Engineering

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One of the ultimate tasks for stencil lithography is the ability to fabricate arrays of structures with controlled dimensions on the nanometer scale precisely positioned on a suitable surface. The race to shrink feature sizes requires the limits of conventional lithography to be extended to high-throughput, low cost, reliable and well-controlled processes of which stencilling is a promising candidate for nanoscale applications. Identifying, predicting and overcoming issues accompanying nanostencil lithography is critical to the successful and timely development of this technique for a wide range of potential applications. This paper addresses phenomena associated with stencil nanopatterning and presents the results of modelling and simulation studies for predicting the deleterious effects of mask distortion and clogging during pattern transfer. It is shown that degrading effects of stress-induced deformation of stencils can be dealt with via optimal design of corrugation structures which in turn reduce stencil deformation and significantly improves pattern definition. Modelling results are validated by comparison to experiment. The corrugation structures can be used to define practical design rules for fabrication of stable large area (''full scale'') purpose-designed stencil membranes. The accurate modelling of the clogging phenomenon combined with gradually evolving stencil deformation, also presented in the paper, can be used for prediction of pattern distortion, to calculate maximum thickness of a deposited layer and/or for prediction of the stencil lifetime.

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Section: Clogging Phenomenon: Empirical and Theoretical Characterizationmentioning

confidence: 99%

Predicting mask distortion, clogging and pattern transfer for stencil lithography

Lishchynska¹,

Bourenkov²,

Boogaart

et al. 2007

Microelectronic Engineering

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“…The suggested approach offers high added value particularly for applications with tough size constraints, such as complex micro-and nano-electromechanical systems 40,41 and implantable devices. 12,17 Smart (bionic) contact lenses-contact lenses with added electronic functionality for, e.g., continuous glucose level monitoring [42][43][44][45][46] -may also benefit from this fabrication approach, since bionic contact lenses need to preserve their flexibility, softness, transparency, strength against mechanical damage, provide liquid and oxygen penetration, and at the same time integrate heterogeneous elements to form a complete and complex functional system at an overall thickness of below 100-200 lm.…”

Section: Discussionmentioning

confidence: 99%

Concept for assembling individual nanostructure-based components into complex devices

Suyatin

Sundberg

Maximov

et al. 2015

Journal of Vacuum Science &Amp; Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phen

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“…Using the Stoney equation and the geometrical dimensions of the setup allows the calculation of changes in stress with temperature. For information on the fabrication of cantilever arrays, deposition of materials libraries on these structures and measurement of actuators with this setup, see [26,27].…”

Section: Cantilever Array Measurementsmentioning

confidence: 99%

Modular high-throughput test stand for versatile screening of thin-film materials libraries

Thienhaus¹,

Hamann²,

Ludwig³

2011

Science and Technology of Advanced Materials

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Versatile high-throughput characterization tools are required for the development of new materials using combinatorial techniques. Here, we describe a modular, high-throughput test stand for the screening of thin-film materials libraries, which can carry out automated electrical, magnetic and magnetoresistance measurements in the temperature range of −40 to 300• C. As a proof of concept, we measured the temperature-dependent resistance of Fe-Pd-Mn ferromagnetic shape-memory alloy materials libraries, revealing reversible martensitic transformations and the associated transformation temperatures. Magneto-optical screening measurements of a materials library identify ferromagnetic samples, whereas resistivity maps support the discovery of new phases. A distance sensor in the same setup allows stress measurements in materials libraries deposited on cantilever arrays. A combination of these methods offers a fast and reliable high-throughput characterization technology for searching for new materials. Using this approach, a composition region has been identified in the Fe-Pd-Mn system that combines ferromagnetism and martensitic transformation.

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MEMS tools for combinatorial materials processing and high-throughput characterization

Cited by 65 publications

References 52 publications

Predicting mask distortion, clogging and pattern transfer for stencil lithography

Predicting mask distortion, clogging and pattern transfer for stencil lithography

Concept for assembling individual nanostructure-based components into complex devices

Modular high-throughput test stand for versatile screening of thin-film materials libraries

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