Exploring the quality of latest sensor prototypes for the CMS Tracker Phase II Upgrade

König, A.

doi:10.1016/j.nima.2016.05.068

Cited by 3 publications

(3 citation statements)

References 4 publications

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“…For the upgrade of the tracker two different types of modules are foreseen: The 2S module which contains two silicon strip sensors with 100 µm pitch, and the PS-module [2,3]. The PS-module consists of a pixel and a strip sensor of n in p-bulk technology ( Fig.…”

Section: Ps Module For the Cms Phase 2 Upgradementioning

confidence: 99%

Status of sensor qualification for the PS module with on-chip pT discrimination for the CMS tracker phase 2 upgrade

Großmann

2017

Nuclear Instruments and Methods in Physics Research Section A:

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The high luminosity upgrade of the LHC is targeted to deliver 3000 fb −1 at a luminosity of 5 × 10 34 cm −2 s −1 . Higher granularity, 140 collisions per bunch crossing and existing bandwidth limitations require a reduction of the amount of data at module level. New modules have binary readout, on-chip p T discrimination and capabilities to provide track finding data at 40 MHz to the L1-trigger. The CMS collaboration has undertaken R&D effort to develop new planar sensors for the pixel-strip (PS) module, which has to withstand 1 × 10 15 cm −2 1 MeV neutron equivalent fluence in the innermost layer of the tracker. The module is composed of a strip sensor and a macro pixel sensor with 100 µm x 1.5 mm pixel size. Sensors were characterized in the laboratory and the effects of different process parameters and sensor concepts were studied. This contribution presents a new sensor prototype with n-pixels in p-bulk material in planar technology for the PS module. A new inverted module concept is presented, which has advantages with respect to the baseline concept. Electrical characterization of sensors and SEM-images are presented. AbstractThe high luminosity upgrade of the LHC is targeted to deliver 3000 fb −1 at a luminosity of 5 × 10 34 cm −2 s −1 . Higher granularity, 140 collisions per bunch crossing and existing bandwidth limitations require a reduction of the amount of data at module level. New modules have binary readout, on-chip p T discrimination and capabilities to provide track finding data at 40 MHz to the L1-trigger. The CMS collaboration has undertaken R&D effort to develop new planar sensors for the pixel-strip (PS) module, which has to withstand 1 × 10 15 cm −2 1 MeV neutron equivalent fluence in the innermost layer of the tracker. The module is composed of a strip sensor and a macro pixel sensor with 100 µm x 1.5 mm pixel size. Sensors were characterized in the laboratory and the effects of different process parameters and sensor concepts were studied. This contribution presents a new sensor prototype with n-pixels in p-bulk material in planar technology for the PS module. A new inverted module concept is presented, which has advantages with respect to the baseline concept. Electrical characterization of sensors and SEM-images are presented.

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Section: Ps Module For the Cms Phase 2 Upgradementioning

confidence: 99%

Status of sensor qualification for the PS module with on-chip pT discrimination for the CMS tracker phase 2 upgrade

Großmann

2017

Nuclear Instruments and Methods in Physics Research Section A:

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“…The 2S-Module combines two identical silicon strip sensors with 90 µm × 5 cm strips [4,5] and has sensor spacings of 1.8 mm or 4 mm. For this module the foreseen readout chip is the CMS Binary Chip (CBC) and the strips are AC-coupled to the chip via the wire bonding technique.…”

Section: Ps Module 2s Modulementioning

confidence: 99%

PS-module prototypes with MPA-light readout chip for the CMS Tracker Phase 2 Upgrade

Großmann¹

2017

J. Inst.

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During the HL-LHC era an instantaneous luminosity of 5 × 10 34 cm −2 s −1 will be reached and possibly 3000 fb −1 integrated luminosity will be delivered. This results in the requirement for a major upgrade of the CMS Outer Tracker detector. This contribution briefly reviews the module types and the front end readout electronics foreseen in the preparation program known as phase 2 upgrade. R&D towards the construction of full module prototypes for the Pixel-Strip (PS) module is ongoing. The module combines a macro-pixel sensor and a strip sensor and has p T-discrimination capability at module level. The current experience from module construction with a demonstrator assembly and initial laboratory testing with an alternative module concept for the PS-module is shown. A possible calibration method is introduced.

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“…The poly-silicon resistor values target to (1.5 ± 0.5)MΩ, but differed from these values for the first batch. Several implantation doses were used in order to calibrate the dose required for 145 the target resistance in later batches [18].…”

mentioning

confidence: 99%

History, status and prospects of producing silicon sensors for HEP experiments at Infineon Technologies

Bergauer

Bartl

Blöch

et al. 2019

Nuclear Instruments and Methods in Physics Research Section A:

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Within this project we are developing single-sided AC-coupled silicon strip sensors and DC-coupled hexagonal pad sensors for applications in High Energy Physics (HEP) experiments. The project started with a feasibility study to re-produce the state-of-the art of silicon sensors of that time, which were based on high-resistivity n-type float-zone 6-inch silicon wafers. Later, the first silicon strip sensors on 8-inch p-type wafers were produced within this project. This influenced the decision of another project to build a silicon sensor based sampling calorimeter. This paper presents the history, current status, and prospects of this sensor development project, jointly conducted by the

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Exploring the quality of latest sensor prototypes for the CMS Tracker Phase II Upgrade

Cited by 3 publications

References 4 publications

Status of sensor qualification for the PS module with on-chip pT discrimination for the CMS tracker phase 2 upgrade

Status of sensor qualification for the PS module with on-chip pT discrimination for the CMS tracker phase 2 upgrade

PS-module prototypes with MPA-light readout chip for the CMS Tracker Phase 2 Upgrade

History, status and prospects of producing silicon sensors for HEP experiments at Infineon Technologies

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