Exposure Characteristics for Chemical Substances and Work Environmental Management in the Semiconductor Assembly Process

Park, Seung-Hyun; Park, Hae Dong; Shin, In Jae

doi:10.15269/jksoeh.2014.24.3.272

Cited by 3 publications

(2 citation statements)

References 6 publications

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“…It is known that certain unused chemicals, including benzene, toluene, cresol, and other chemicals, are generated during the pyrolysis of photoresist products containing novolac resin [17]; more sensitive workers might feel uncomfortable about the attendant risk of adverse health effects [18].…”

Section: Discussionmentioning

confidence: 99%

“…Although almost all of the EMCs were composed of silica (average 90%) and carbon black (average 1%), epoxy and/or phenolic resins were also present in EMCs and photoresist products. It was reported previously that benzene (an IARC group 1 carcinogen), phenol, and formaldehyde (an IARC group 1 carcinogen) were generated as byproducts of EMCs during the molding process, although their concentrations were low [17,19]. Pb was used as a solder ball ingredient in the past, but is no longer used because it is subject to the European Union (EU) legislation on the restriction of hazardous substances (RoHS) [20].…”

Section: Discussionmentioning

confidence: 99%

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Chemical use in the semiconductor manufacturing industry

Kim

Yoon

Ham

et al. 2018

International Journal of Occupational and Environmental Health

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Background:The semiconductor industry is known to use a number of chemicals, but little is known about the exact chemicals used due to the ingredients being kept as a trade secret. Objectives: The objective of this study was to analyze chemical use using a safety data sheet (SDS) and chemical inventory provided by a major semiconductor company, which operated two factories (A and B). Methods: Descriptive statistics were obtained on the number of chemical products and ingredients, photoresists, and carcinogens, classified by the International Agency for Research on Cancer (IARC), as well as trade secret ingredients. The total chemical use per year was estimated from chemical inventories mass (kg). Results: A total of 428 and 432 chemical products were used in factories A and B, respectively. The number of pure chemical ingredients, after removing both trade secret ingredients and multiple counting, was 189 and 157 in factories A and B, respectively. The number of products containing carcinogens, such as sulfuric acid, catechol, and naphthalene was 47/428 (A) and 28/432 (B). Chemicals used in photolithography were 21% (A) and 26% (B) of all chemical products, and more than 97% among them were chemicals containing trade secret ingredients. Conclusions: Each year, 4.3 and 8.3 tons of chemicals were used per person in factories A and B, respectively. Because of the high level of commercial secrecy and the use of many unregulated chemicals, more sustainable policies and methods should be implemented to address health and safety issues in the semiconductor industry.

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Section: Discussionmentioning

confidence: 99%

Section: Discussionmentioning

confidence: 99%

Chemical use in the semiconductor manufacturing industry

Kim

Yoon

Ham

et al. 2018

International Journal of Occupational and Environmental Health

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Clean Room Structure, Air Conditioning and Contamination Control Systems in the Semiconductor Fabrication Process

Choi¹,

Lee²,

Cho³

et al. 2015

Journal of Korean Society of Occupational and Environmental Hyg

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Physicochemical Characterization of Powder Byproducts Generated from a Metallization Process and Its 1st Scrubber in the Semiconductor Industry

Choi

Jung²,

An³

2015

Journal of Korean Society of Occupational and Environmental Hyg

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Objectives: The aim of this study is to identify physicochemical properties such as chemical composition, size, shape and crystal structure of powder byproducts generated from a metallization process and its 1st scrubber in the semiconductor industry. Methods: Powder samples were collected from inner chambers during maintenance of the W-plug process equipment (using tungsten hexafluoride as a precursor material) and its 1st scrubber. The chemical composition, size and shape of the powder particles were determined by field emission scanning electron microscopy (SEM) and transmission electron microscopy (TEM) equipped with an energy dispersive spectroscope (EDS). The crystal structure of the powders was analyzed by X-ray diffraction (XRD). Results: From the SEM-EDS and TEM-EDS analyses, O and W were mainly detected, which indicates the powder byproducts are tungsten trioxide (WO3), whereas Al, F and Ti were detected as low peaks. The powder particles were spherical and nearly spherical, and the particle size collected from the process equipment and its 1st scrubber showed 10-20 nm (agglomerates: 55-90 nm) and 16-20 nm (agglomerates: 80-120 nm) as primary particles, respectively. The XRD patterns of the yellow powder byproducts exhibit five peaks at 23.8ﾟ, 33.9ﾟ, 41.74ﾟ, 48.86ﾟ and 54.78ﾟ, which correspond to the (200), ( 220), ( 222), (400), and (420) planes of cubic WO3. Conclusions: We elucidated the physicochemical characteristics of the powder byproducts collected from W-plug process equipment and its 1st scrubber. This study should provide useful information for the development of alternative strategies to improve the working environment and workers' health.

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Exposure Characteristics for Chemical Substances and Work Environmental Management in the Semiconductor Assembly Process

Cited by 3 publications

References 6 publications

Chemical use in the semiconductor manufacturing industry

Chemical use in the semiconductor manufacturing industry

Clean Room Structure, Air Conditioning and Contamination Control Systems in the Semiconductor Fabrication Process

Physicochemical Characterization of Powder Byproducts Generated from a Metallization Process and Its 1st Scrubber in the Semiconductor Industry

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