Fabricating high thermal conductivity rGO/polyimide nanocomposite films <i>via</i> a freeze-drying approach

Wei, Shiyang; Yu, Qiaoxi; Fan, Zhongjie; Liu, Siwei; Chi, Zhenguo; Chen, Xudong; Zhang, Yi; Xu, Jiarui

doi:10.1039/c8ra00827b

Cited by 28 publications

(15 citation statements)

References 43 publications

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“…However, the reported λ values of thermally conductive PI-based composite films are still far from expectation [18,19]. One of the most important bottlenecks lies in the inherent interfaces between phases and the high interfacial thermal resistance (ITR) [20], which largely limits the efficiency of improvement for λ of thermally conductive composite films [21].…”

Section: Introductionmentioning

confidence: 99%

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

et al. 2021

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The developing flexible electronic equipment are greatly affected by the rapid accumulation of heat, which is urgent to be solved by thermally conductive polymer composite films. However, the interfacial thermal resistance (ITR) and the phonon scattering at the interfaces are the main bottlenecks limiting the rapid and efficient improvement of thermal conductivity coefficients (λ) of the polymer composite films. Moreover, few researches were focused on characterizing ITR and phonon scattering in thermally conductive polymer composite films. In this paper, graphene oxide (GO) was aminated (NH2-GO) and reduced (NH2-rGO), then NH2-rGO/polyimide (NH2-rGO/PI) thermally conductive composite films were fabricated. Raman spectroscopy was utilized to innovatively characterize phonon scattering and ITR at the interfaces in NH2-rGO/PI thermally conductive composite films, revealing the interfacial thermal conduction mechanism, proving that the amination optimized the interfaces between NH2-rGO and PI, reduced phonon scattering and ITR, and ultimately improved the interfacial thermal conduction. The in-plane λ (λ∥) and through-plane λ (λ⊥) of 15 wt% NH2-rGO/PI thermally conductive composite films at room temperature were, respectively, 7.13 W/mK and 0.74 W/mK, 8.2 times λ∥ (0.87 W/mK) and 3.5 times λ⊥ (0.21 W/mK) of pure PI film, also significantly higher than λ∥ (5.50 W/mK) and λ⊥ (0.62 W/mK) of 15 wt% rGO/PI thermally conductive composite films. Calculation based on the effective medium theory model proved that ITR was reduced via the amination of rGO. Infrared thermal imaging and finite element simulation showed that NH2-rGO/PI thermally conductive composite films obtained excellent heat dissipation and efficient thermal management capabilities on the light-emitting diodes bulbs, 5G high-power chips, and other electronic equipment, which are easy to generate heat severely.

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Section: Introductionmentioning

confidence: 99%

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

et al. 2021

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“…The thermal conductivities of PI composites in the literature are depicted in Figure . Previously reported PI composites need higher filler loading to achieve high thermal conductivity.…”

Section: Resultsmentioning

confidence: 99%

Significantly enhanced thermal conductivity in polyimide composites with the matching of graphene flakes and aluminum nitride by in situ polymerization

Wang

2019

Polymer Composites

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Highly thermally conductive polymer composites are urgently required for effective heat dissipation in advanced electronic devices. Rational matching of thermal conductive fillers and proper preparation method are important for obtaining a highly thermally conductive composites at low filler content. Here we report polyimide (PI) composites filled with graphene flakes (GF) and polyhedral aluminum nitride (AlN), which simultaneously exhibit high thermal conductivity, improved thermal mechanical properties, and excellent thermal stability. PI composite films were readily prepared by in situ polymerization at the presence of fillers that are dispersed with sonication. The thermal conductivity of PI composite films reached 11.19 Wm −1 K −1 at the low content of 1 wt% GF and 10 wt% AlN, which is ascribed to the construction of synergistically enhanced heat transfer pathways by the combination of the hybrid fillers. The PI composite films with hybrid fillers also showed lower electrical conductivity than that of the PI composite films with single GF filler. This study provides an effective method for preparation of highperformance thermal management materials. K E Y W O R D Sin situ polymerization, matching, polyimide, thermal conductivity

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“…Rosin-based polymers have been generally implemented not only in traditional fields such as coatings [ 39 ] and adhesives [ 40 ], but also in emerging fields such as energy [ 41 ], environment [ 42 ], drug delivery [ 43 ] and drug analysis. There are several methods for the preparation of composite membranes, including the casting flow method [ 44 ], freeze-drying approach [ 45 ] and electrostatic spinning et al The composite membranes prepared by electrospinning have unique properties such as high specific surface area and uniform nanofiber structure. Electrospinning is currently applied in various applications including electrochemistry, natural product extraction, medicine, the environment and batteries.…”

Section: Introductionmentioning

confidence: 99%

Preparation of Rosin-Based Composite Membranes and Study of Their Dencichine Adsorption Properties

Liu

et al. 2022

Polymers

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In this work, rosin-based composite membranes (RCMs) were developed as selective sorbents for the preparation of dencichine for the first time. The rosin-based polymer microspheres (RPMs) were synthesized using 4-ethylpyridine as a functional monomer and ethylene glycol maleic rosinate acrylate as a crosslinking. RCMs were prepared by spinning the RPMs onto the membranes by electrostatic spinning technology. The optimization of various parameters that affect RCMs was carried out, such as the ratio concentration and voltage intensity of electrospinning membrane. The RCMs were characterized by SEM, TGA and FT-IR. The performances of RCMs were assessed, which included adsorption isotherms, selective recognition and adsorption kinetics. The adsorption of dencichine on RCMs followed pseudo-second-order and adapted Langmuir–Freundlich isotherm model. As for the RCMs, the fast adsorption stage appeared within the first 45 min, and the experimental maximum adsorption capacity was 1.056 mg/g, which is much higher than the previous dencichine adsorbents reported in the literature. The initial decomposition temperature of RCMs is 297 °C, the tensile strength is 2.15 MPa and the elongation at break is 215.1%. The RCMs have good thermal stability and mechanical properties. These results indicated that RCMs are a tremendously promising adsorbent for enriching and purifying dencichine from the notoginseng extracts.

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Fabricating high thermal conductivity rGO/polyimide nanocomposite films via a freeze-drying approach

Abstract: PI composite films with excellent thermal conductivity (as high as 2.78 W m−1 K−1) have been fabricated by a freeze drying approach.

Cited by 28 publications

References 43 publications

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

Significantly enhanced thermal conductivity in polyimide composites with the matching of graphene flakes and aluminum nitride by in situ polymerization

Preparation of Rosin-Based Composite Membranes and Study of Their Dencichine Adsorption Properties

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