2014
DOI: 10.1016/j.enconman.2013.12.019
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Fabrication and analysis of small-scale thermal energy storage with conductivity enhancement

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Cited by 65 publications
(18 citation statements)
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“…organic PCMs and inorganic salts PCMs) is their poor thermal conductivity (0.1-1.0 W/mK), which prolongs the melting (charging) and solidification (discharging) times of a heat storage unit based on these materials. This shortcoming limits their deployment in large scale applications of latent heat TES technology in practical systems [5,6].…”
Section: Introductionmentioning
confidence: 99%
“…organic PCMs and inorganic salts PCMs) is their poor thermal conductivity (0.1-1.0 W/mK), which prolongs the melting (charging) and solidification (discharging) times of a heat storage unit based on these materials. This shortcoming limits their deployment in large scale applications of latent heat TES technology in practical systems [5,6].…”
Section: Introductionmentioning
confidence: 99%
“…The example of commonly used methods include the dispersion of high conductivity particles in the PCM [14][15][16][17], embedding the PCM in the high conductivity porous medium [18][19][20][21][22][23][24] as well as inserting extended surfaces and fins [25][26][27][28].…”
Section: Introductionmentioning
confidence: 99%
“…Worse still, the low thermal conductivity of many prospective PCMs, especially the organic ones, become one of the most important bottlenecks that limit its applications in thermal management. To address these problems, metal fins/foams, ceramics and nanocarbon materials have been introduced to improve the structural strength and thermal conductivity of PCMs [18][19][20][21][22][23][24].…”
Section: Introductionmentioning
confidence: 99%