Fabrication and characterization of hexagonal boron nitride/polyester composites to study the effect of filler loading and surface modification for microelectronic applications

Abstract

This work investigates a composite prepared with polyester and hexagonal boron nitride (hBN) in terms of the properties required in the material for microelectronics applications. The influence of filler loading and the surface treatment of hBN with a silane coupling agent (γ‐aminopropyl triethoxy silane) is studied. It has been observed that the silane‐modified hBN improves the compatibility and adhesion with the matrix as verified by SEM images. The experimental investigation reveals that the addition of hBN in polyester unwillingly rises the density, voids content, and water absorption rate. Though, the increment is limited with surface‐modified hBN. The material's mechanical properties improve with filler loading over a particular range of filler loading. The material's thermal conductivity and glass transition temperature increase with hBN content, whereas the coefficient of thermal expansion reduces. Polyester when filled with 40 wt% of the silane‐hBN, the thermal conductivity improves around six times that of unfilled polyester. The dielectric properties are marginally augmented with filler loading whereas, the increase in frequency results in the reduction of dielectric properties. It can be observed from the overall experimental analysis that the developed material can be used in different microelectronic applications. Highlights A new class of composite is developed with polyester and raw/modified hBN. Composite with modified hBN shows improved physical/mechanical properties. Thermal properties of polyester improved appreciably with treated hBN. The dielectric properties of composites remain well within the range. The fabricated composites are recommended for microelectronics applications.

Development of hBN/natural fibres reinforced polymer composites using grey relation grade analysis for thermal and electrical applications

“…In addition, only a small amount of hBN particles filled in the polymer matrix show, increased heat conductivity. Moreover, the 15% volume of hBN filler increased the thermal conductivity of the polymer composites by over 15% [28][29][30]. Xu et al [31] investigated the effect of hBN filler on the thermal characteristics of the MPP hybrid composites reinforced with synthetic carbon fiber that were interlaced.…”

Enhancing Thermal Conductivity in Polymer Composites through Molding-Assisted Orientation of Boron Nitride

“…However, electrically insulating fillers primarily rely on phonon heat conduction and necessitate higher filler concentrations to establish a continuous thermally conductive network and minimize interface thermal resistance, thereby enhancing thermal conductivity. The employment of linear or planar fillers [ 17 ] with high aspect ratios, such as boron nitride nanosheets [ 4 , 18 , 19 , 20 , 21 , 22 , 23 , 24 , 25 , 26 ] (BNNSs), silicon carbide (SiC) nanowires [ 27 ], graphene or graphene oxide (GO) [ 28 , 29 , 30 , 31 , 32 , 33 , 34 , 35 ], carbon nanotubes (CNTs) [ 36 , 37 , 38 , 39 ], and MXene [ 8 , 40 ], facilitates the creation of a thermally conductive network at relatively low filler loadings compared to other filler geometries. Furthermore, the typical association of high filler loadings with compromised mechanical properties has led researchers to modify filler surfaces to enhance their dispersion within polymer matrices, thereby realizing highly thermally conductive polymer composites at reduced filler concentrations [ 26 , 36 , 41 , 42 , 43 , 44 , 45 , 46 ].…”

“…The employment of linear or planar fillers [ 17 ] with high aspect ratios, such as boron nitride nanosheets [ 4 , 18 , 19 , 20 , 21 , 22 , 23 , 24 , 25 , 26 ] (BNNSs), silicon carbide (SiC) nanowires [ 27 ], graphene or graphene oxide (GO) [ 28 , 29 , 30 , 31 , 32 , 33 , 34 , 35 ], carbon nanotubes (CNTs) [ 36 , 37 , 38 , 39 ], and MXene [ 8 , 40 ], facilitates the creation of a thermally conductive network at relatively low filler loadings compared to other filler geometries. Furthermore, the typical association of high filler loadings with compromised mechanical properties has led researchers to modify filler surfaces to enhance their dispersion within polymer matrices, thereby realizing highly thermally conductive polymer composites at reduced filler concentrations [ 26 , 36 , 41 , 42 , 43 , 44 , 45 , 46 ]. However, these surface modification processes often entail intricate chemical reactions that may diminish the fillers’ intrinsic thermal conductivity.…”

“…Recently, the development of filler networks has gained prominence in various environmental fields, underscoring a paradigm shift towards innovative composite materials [ 26 , 36 , 41 , 42 , 43 , 44 , 45 , 46 ]. Guo et al [ 47 ] utilized a gradient temperature field to fabricate alternating layers of GO and BN through an ice-template method, achieving a polyimide composite with an in-plane thermal conductivity of 1.49 W/m·K at a filler loading of 3.8 wt%.…”

High thermal conductivity electrical insulation composite EP/h‐BN obtained by DC electric field induction

“…Some researchers have modified the filler surface to improve the compatibility between the filler and the matrix in order to increase the thermal conductivity of the composite. 21,22 Some researchers have modified the fillers with dimensionality and the core-shell structure to achieve the expected properties of the composites. [23][24][25][26] Yet, the filler design is often very challenging, with high costs and low yields, making it impossible to achieve large-scale applications.…”