2016 IEEE 66th Electronic Components and Technology Conference (ECTC) 2016
DOI: 10.1109/ectc.2016.129
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Fabrication and Characterization of Low Stress Si Interposer with Air-Gapped Si Interconnection for Hermetical System-in-Package

Rongfeng Luo
1
,
Kuili Ren
2
,
Shenglin Ma
3
et al.
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