2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) 2022
DOI: 10.1109/ectc51906.2022.00143
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Fabrication and Characterization of Nanoporous Gold (NPG) Interconnects for Wafer Level Packaging

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Cited by 2 publications
(3 citation statements)
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“…As far as oxygen is concerned, one important impediment inherent to this approach had, however, to be conquered first, namely the fact that, under UHV conditions, molecular oxygen cannot be activated on Au surfaces. The effectiveness of this restriction was validated for polycrystalline as well as for various single-crystal Au surfaces, including stepped ones, such as Au (221), for pressures up to 1 bar and temperatures up to 900 K. 425−428 This inability is not unexpected and perfectly in line with theoretical calculations predicting very low adsorption energies and high dissociation barriers for molecular oxygen on pure gold surfaces (section 4.1).…”
Section: 2mentioning
confidence: 57%
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“…As far as oxygen is concerned, one important impediment inherent to this approach had, however, to be conquered first, namely the fact that, under UHV conditions, molecular oxygen cannot be activated on Au surfaces. The effectiveness of this restriction was validated for polycrystalline as well as for various single-crystal Au surfaces, including stepped ones, such as Au (221), for pressures up to 1 bar and temperatures up to 900 K. 425−428 This inability is not unexpected and perfectly in line with theoretical calculations predicting very low adsorption energies and high dissociation barriers for molecular oxygen on pure gold surfaces (section 4.1).…”
Section: 2mentioning
confidence: 57%
“…That is of interest because lithographic structuring may, in principle, be seamlessly integrated into microtechnology manufacturing schemes. Wire- and disk-shaped samples have been demonstrated, and an example is shown in Figure C …”
Section: Tuning Of Structure and Composition During Dealloyingmentioning
confidence: 99%
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