1995
DOI: 10.1117/12.220936
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Fabrication and characterization of the Pd-silicided emitters for field-emission devices

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“…Molding, [1][2][3] through-aperture evaporation, [4][5][6][7][8][9] dry etching, [10][11][12][13][14][15] hot-embossing, 16 stamping, 17 and wet etching 18,19 have all been proposed as means of fabricating Spindt-type field emission arrays (FEA). In the case of molding techniques, [1][2][3] tips are formed by the deposition of the emitter material on mask protrusions.…”
Section: Introductionmentioning
confidence: 99%
“…Molding, [1][2][3] through-aperture evaporation, [4][5][6][7][8][9] dry etching, [10][11][12][13][14][15] hot-embossing, 16 stamping, 17 and wet etching 18,19 have all been proposed as means of fabricating Spindt-type field emission arrays (FEA). In the case of molding techniques, [1][2][3] tips are formed by the deposition of the emitter material on mask protrusions.…”
Section: Introductionmentioning
confidence: 99%