2014 IEEE 40th Photovoltaic Specialist Conference (PVSC) 2014
DOI: 10.1109/pvsc.2014.6925459
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Fabrication and encapsulation of perovskites sensitized solid state solar cells

Abstract: Perovskite-based solar cells are now emerging as an economically viable alternative for efficient photovoltaic energy harvesting. Using solution-based processing routes alone, devices with power conversion efficiencies exceeding 15% can be fabricated, in principle at a fraction of costs reported for other photovoltaic technologies. In these excitonic solar cells, the perovskites multifunctional nature allow these layers to behave as light absorber, electron conductor and hole transporting material, depending o… Show more

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Cited by 9 publications
(6 citation statements)
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“…We conclude this review by discussing other passivating materials than the ultrathin organic surface modifiers presented in the previous section. More generally speaking, various encapsulation methods have been proposed to shield the completed PSC device from external factors, starting from early approaches using organic materials such as Surlyn 326 and continuing to thermoplastic polymers with integrated adhesive, 327,328 or ethylene vinyl acetate, which were shown to improve PSC mechanical stability after thermal cycling better than Surlyn encapsulation. 329 As a promising alternative to these organic encapsulants, amorphous TiO 2 or SnO x layers made by atomic layer deposition (ALD) have been used as barriers against moisture infiltration in PSCs.…”
Section: Chemical Reviewsmentioning
confidence: 99%
“…We conclude this review by discussing other passivating materials than the ultrathin organic surface modifiers presented in the previous section. More generally speaking, various encapsulation methods have been proposed to shield the completed PSC device from external factors, starting from early approaches using organic materials such as Surlyn 326 and continuing to thermoplastic polymers with integrated adhesive, 327,328 or ethylene vinyl acetate, which were shown to improve PSC mechanical stability after thermal cycling better than Surlyn encapsulation. 329 As a promising alternative to these organic encapsulants, amorphous TiO 2 or SnO x layers made by atomic layer deposition (ALD) have been used as barriers against moisture infiltration in PSCs.…”
Section: Chemical Reviewsmentioning
confidence: 99%
“…There are also many fabrication methods, ranging from commercial-friendly methods to highly sophisticated and costly methods. Some of the low-cost techniques have been tried and tested to fabricate PSC devices, such as spray pyrolysis technique (Razza et al, 2015) and also spin coating of dye-sol paste (Ramos et al, 2014).…”
Section: Resultsmentioning
confidence: 99%
“…Single-step high-temperature encapsulation (>150 • C) was reported to result in the delamination of active and metallization layers in devices. In contrast, the two-step encapsulation approach minimizes the defects that occur due to mechanical and thermal stress [329]. In a two-step encapsulation approach, the first step consists of making electrical contact and later embedding it in a polymer matrix to ensure mechanical stability.…”
Section: Sealing/encapsulationmentioning
confidence: 99%