Fabrication, Assembly, and Testing of Cu- and Al-Based Microchannel Heat Exchangers

Mei, Fanghua; Parida, Pritish R.; Jiang, Jing; Meng, W. J.; Ekkad, Srinath V.

doi:10.1109/jmems.2008.924276

“…Data in figure 4(b) show that smaller D h results in higher values of h eff . These results are consistent with conclusions from previous studies [4,10,11], and show that the microchannel-level heat transfer performance, h eff , is determined mainly by D h -smaller D h leads to higher performance. In figure 4(a), similar h eff values are observed for MHE specimens with different S values.…”

Section: Resultssupporting

confidence: 93%

“…In contrast, metal-based MHEs offer better heat transfer performance by taking advantage of the high thermal conductivities of metals and the high rates of liquid-solid convective heat transfer within microchannels [10,11]. In this paper, we report on results of fabrication and bonding of low-profile Cu MHEs with varying geometric dimensions.…”

Section: Introductionmentioning

confidence: 99%

Fabrication, assembly and heat transfer testing of low-profile copper-based microchannel heat exchangers

Lü¹,

Chen²,

Meng³

et al. 2010

J. Micromech. Microeng.

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Low-profile, Cu-based microchannel heat exchangers (MHEs) with different geometric dimensions were fabricated, bonded and assembled. A transient liquid phase (TLP) process was used for bonding of Cu-based MHEs with total thicknesses ranging from 600 μm to 1700 μm. The structural integrity of TLP-bonded Cu MHEs was examined. Device-level heat transfer testing was performed on a series of Cu-based MHEs to study the influence of microchannel dimensions on overall heat transfer performance, corroborated by computational results from a simple 2D finite element analysis. The present results demonstrate the promise of low-profile metallic MHEs for high heat flux cooling applications.

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“…In recent years, many researchers have focused on modeling of the heat transfer and optimization of the micro-channel geometry [3][4][5][6]. And the fabrication process of micro-channels integrated in substrate also have been studied by many researchers [7][8][9][10][11]. But there is no any studies on the feasibility of the micro-channel integrated in substrate for packaging processes having been reported.…”

Section: Introductionmentioning

confidence: 99%

Effect of micro-channel on warpage and residual stress due to reflow process in IGBT modules

Zhang

¹

,

Xu

²

,

Zhang

³

et al. 2014

2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction M

0

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With the trend to be smaller, more integration and higher power in power electronic technology, the cooling problem has become increasingly prominent for those high power devices. Micro-channel in substrate, as an effective cooling method, has been proposed and investigated by many researchers in recent years. Warpage and stress, naturally existing in all the packaging processes due to the unavoidable mismatch of coefficient of thermal expansion (CTE) between materials, can be problematic on reliability. Compared to the traditional substrate, the substrate integrated with micro-channel maybe result in the increase of the warpage and residual stress after packaging processes. In this paper a 1200V Insulated Gate Bipolar Transistor (IGBT) module as a prototype was investigated to describe effects of the microchannel on warpage and residual stress of the substrate due to reflow process. Finite element analysis method with viscoplastic solder model was used to study the reflow process. The Anand constitutive model, which has been adopted successfully to represent the viscoplastic behavior of solder materials, was used to model the material properties of SAC305 solder layers in this study. The whole reflow process was modeled by element "death and activation" technology, and the traditional substrate model and the model of the substrate integrated with microchannel were taken for comparison. The effect of the size and the arrangement of the micro-channel in substrate on warpage and residual stresses after reflow process were also studied.

show abstract

“…In recent years, many researchers have focused on modeling of the heat transfer and optimization of the micro-channel geometry [3][4][5][6]. And the fabrication process of micro-channels integrated in substrate also have been studied by many researchers [7][8][9][10][11]. But there is no any studies on the feasibility of the micro-channel integrated in substrate for packaging processes having been reported.…”

Section: Introductionmentioning

confidence: 99%

Effect of micro-channel on warpage and residual stress due to reflow process in IGBT modules

Zhou

¹

,

Xu

²

,

Zhang

³

et al. 2014

2014 15th International Conference on Electronic Packaging Technology

2

0

View full text Add to dashboard Cite

With the trend to be smaller, more integration and higher power in power electronic technology, the cooling problem has become increasingly prominent for those high power devices. Micro-channel in substrate, as an effective cooling method, has been proposed and investigated by many researchers in recent years. Warpage and stress, naturally existing in all the packaging processes due to the unavoidable mismatch of coefficient of thermal expansion (CTE) between materials, can be problematic on reliability. Compared to the traditional substrate, the substrate integrated with micro-channel maybe result in the increase of the warpage and residual stress after packaging processes. In this paper a 1200V Insulated Gate Bipolar Transistor (IGBT) module as a prototype was investigated to describe effects of the microchannel on warpage and residual stress of the substrate due to reflow process. Finite element analysis method with viscoplastic solder model was used to study the reflow process. The Anand constitutive model, which has been adopted successfully to represent the viscoplastic behavior of solder materials, was used to model the material properties of SAC305 solder layers in this study. The whole reflow process was modeled by element "death and activation" technology, and the traditional substrate model and the model of the substrate integrated with microchannel were taken for comparison. The effect of the size and the arrangement of the micro-channel in substrate on warpage and residual stresses after reflow process were also studied.

show abstract

Fabrication, Assembly, and Testing of Cu- and Al-Based Microchannel Heat Exchangers

Cited by 51 publications

References 35 publications

Fabrication, assembly and heat transfer testing of low-profile copper-based microchannel heat exchangers

Fabrication, assembly and heat transfer testing of low-profile copper-based microchannel heat exchangers

Effect of micro-channel on warpage and residual stress due to reflow process in IGBT modules

Effect of micro-channel on warpage and residual stress due to reflow process in IGBT modules

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