In this paper, finite element (FE) analyses of the production process of piezo‐metal‐compounds are considered. The compounds consist of two adhesively bonded metal sheets with embedded actuator/sensor patches. During the production process, the patches are placed inside an uncured adhesive layer and the prepared compound is formed to its final shape, while the uncured adhesive serves as a floating support and protects the actuator/sensor patch. Only after forming, the adhesive is fully cured in order to achieve a complete load transfer between the structure and the actuator/sensor patch. For the described production process, two different adhesives are investigated within finite element simulations: a cold‐curing, two‐component, epoxy based adhesive, and a heat‐curing, one‐component polyurethane adhesive. Both adhesives have already been investigated by different experimental methods to obtain the thermal, chemical, and mechanical properties and to formulate corresponding phenomenological models. Moreover, these models are implemented into the FE software ANSYS. This paper concentrates on the FE modeling and corresponding analyses of the spatially and temporally controlled thermal activation during the production process of piezo‐metal‐compounds. The basic applicability of both adhesive systems is evaluated and suitable ranges for process parameters, like temperature ranges or the duration of dwell times, are given.